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Volumn , Issue , 2009, Pages 7-18

Reliability of AlGaN/GaN HEMT: Impact of acceleration condition on dominant degradation mechanism

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION CONDITION; ALGAN/GAN HEMTS; BASE PLATES; CHANNEL TEMPERATURE; DEGRADATION MECHANISM; DRAIN BIAS; ELECTRON TRAPPING; GATE CURRENT; HIGH-VOLTAGE OPERATION; INVERSE PIEZOELECTRIC EFFECTS; OVERLOAD TESTS; RELIABILITY TESTING;

EID: 72449134262     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (14)
  • 1
    • 72449174146 scopus 로고    scopus 로고
    • Is GaN Ready for System Insertion?, in Proc of WMF (IMS) workshop, MTT-S, 2009
    • "Is GaN Ready for System Insertion?", in Proc of WMF (IMS) workshop, MTT-S, 2009
  • 3
    • 72449156946 scopus 로고    scopus 로고
    • R. Pengelly, GaN HEMT Technical Status: Transistors and MMICs for Military and Commercial Systems, Proc of WMF (IMS) seminar, pp. 1-25, MTT-S, 2009
    • R. Pengelly, "GaN HEMT Technical Status: Transistors and MMICs for Military and Commercial Systems", Proc of WMF (IMS) seminar, pp. 1-25, MTT-S, 2009
  • 4
    • 72449167789 scopus 로고    scopus 로고
    • M. Wojtowicz, Status of GaN HEMT Technology for mmW Applications, Proc of WMF (IMS) seminar, pp. 63-78, MTT-S, 2009
    • M. Wojtowicz, "Status of GaN HEMT Technology for mmW Applications", Proc of WMF (IMS) seminar, pp. 63-78, MTT-S, 2009
  • 5
    • 41749104473 scopus 로고    scopus 로고
    • Gate current degradation mechanisms of GaN high electron mobility transistors
    • J. Joh and J. A. del Alamo, "Gate current degradation mechanisms of GaN high electron mobility transistors," in IEDM Tech. Dig., 2007, pp. 385-388
    • (2007) IEDM Tech. Dig , pp. 385-388
    • Joh, J.1    del Alamo, J.A.2
  • 8
    • 72449139904 scopus 로고    scopus 로고
    • S.Y. Park, Carlo Floresca, Uttiya Chowdhury, Jose L. Jimenez, Cathy Lee, Edward Beam, Paul Saunier, Tony Balistreri, Moon J. Kim, Physical degradation of GaN HEMT devices under high drain bias reliability testing,
    • S.Y. Park, Carlo Floresca, Uttiya Chowdhury, Jose L. Jimenez, Cathy Lee, Edward Beam, Paul Saunier, Tony Balistreri, Moon J. Kim, "Physical degradation of GaN HEMT devices under high drain bias reliability testing",
  • 11
    • 33846276942 scopus 로고    scopus 로고
    • Reliability of compound semiconductor workshop historical review
    • Palm Springs, CA, USA
    • W.J. Roesch, "Reliability of compound semiconductor workshop historical review", Proc. of ROCS workshop, pp. 1-17, Palm Springs, CA, USA, 2005
    • (2005) Proc. of ROCS workshop , pp. 1-17
    • Roesch, W.J.1
  • 12
    • 72449206475 scopus 로고    scopus 로고
    • Performance stability of AlGaN/GaN HFET: Effect of plasma processing
    • T. Baksht, Y. Knafo, I. Yehuda, and G Bunin, "Performance stability of AlGaN/GaN HFET: effect of plasma processing", Phys. Stat. Sol. (c) 5, No. 6, pp.2033-2036, 2008
    • (2008) Phys. Stat. Sol. (c) , vol.5 , Issue.6 , pp. 2033-2036
    • Baksht, T.1    Knafo, Y.2    Yehuda, I.3    Bunin, G.4
  • 13
    • 84887419193 scopus 로고    scopus 로고
    • Thermal and Piezoelectric Stress in Operating AlGaN/GaN HFET Devices and Effect of the Fe Doping in the GaN Buffer Layer
    • Tampa, Florida
    • A. Sarua, T. Batten, H. Ji, M. J. Uren, T. Martin M. Kuball," Thermal and Piezoelectric Stress in Operating AlGaN/GaN HFET Devices and Effect of the Fe Doping in the GaN Buffer Layer", in in Proc. ManTech conf, Tampa, Florida, 2009.
    • (2009) in Proc. ManTech conf
    • Sarua, A.1    Batten, T.2    Ji, H.3    Uren, M.J.4    Martin, T.5    Kuball, M.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.