-
1
-
-
72449174146
-
-
Is GaN Ready for System Insertion?, in Proc of WMF (IMS) workshop, MTT-S, 2009
-
"Is GaN Ready for System Insertion?", in Proc of WMF (IMS) workshop, MTT-S, 2009
-
-
-
-
2
-
-
46149123426
-
GAN-on-Si Reliability: A Comparative Study Between Process Platforms
-
San Antonio, TX, USA
-
S. Singnal, A. Chaudhari, A. Hanson, J. Johnson R.Therrien, P. Rajagopal, T. Li, C. Park, A. Edwards, E. Piner, I.Kizilyalli and K. Linthicum, "GAN-on-Si Reliability: A Comparative Study Between Process Platforms.", Proc. of ROCS workshop, pp. 21-25, San Antonio, TX, USA, 2006
-
(2006)
Proc. of ROCS workshop
, pp. 21-25
-
-
Singnal, S.1
Chaudhari, A.2
Hanson, A.3
Johnson, J.4
Therrien, R.5
Rajagopal, P.6
Li, T.7
Park, C.8
Edwards, A.9
Piner, E.10
Kizilyalli, I.11
Linthicum, K.12
-
3
-
-
72449156946
-
-
R. Pengelly, GaN HEMT Technical Status: Transistors and MMICs for Military and Commercial Systems, Proc of WMF (IMS) seminar, pp. 1-25, MTT-S, 2009
-
R. Pengelly, "GaN HEMT Technical Status: Transistors and MMICs for Military and Commercial Systems", Proc of WMF (IMS) seminar, pp. 1-25, MTT-S, 2009
-
-
-
-
4
-
-
72449167789
-
-
M. Wojtowicz, Status of GaN HEMT Technology for mmW Applications, Proc of WMF (IMS) seminar, pp. 63-78, MTT-S, 2009
-
M. Wojtowicz, "Status of GaN HEMT Technology for mmW Applications", Proc of WMF (IMS) seminar, pp. 63-78, MTT-S, 2009
-
-
-
-
5
-
-
41749104473
-
Gate current degradation mechanisms of GaN high electron mobility transistors
-
J. Joh and J. A. del Alamo, "Gate current degradation mechanisms of GaN high electron mobility transistors," in IEDM Tech. Dig., 2007, pp. 385-388
-
(2007)
IEDM Tech. Dig
, pp. 385-388
-
-
Joh, J.1
del Alamo, J.A.2
-
6
-
-
59649123041
-
Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives
-
G.Meneghesso, G. Verzellesi, F. Danesin, F. Rampazzo, F. Zanon, A. Tazzoli, M. Meneghini, and E. Zanoni, "Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives", IEEE trans. on Device and Materials and Reliability; pp.332-343, Vol.8, no.2, 2008
-
(2008)
IEEE trans. on Device and Materials and Reliability
, vol.8
, Issue.2
, pp. 332-343
-
-
Meneghesso, G.1
Verzellesi, G.2
Danesin, F.3
Rampazzo, F.4
Zanon, F.5
Tazzoli, A.6
Meneghini, M.7
Zanoni, E.8
-
7
-
-
70449101255
-
Reliability and Degradation Mechanism of AlGaN/GaN HEMTs for Next Generation Mobile Communication Systems
-
Monterrey, CA, USA
-
M. Dammann, W. Pletschen, P. Waltereit, W. Bronner, R. Quay, S. Müller, M. Mikulla, O. Ambacher, P. van der Wei, S. Murad, T. Rödle, R. Behtash, F. Bourgeois, K. Riepe, M. Fagerlind, and E. Sveinbjörnsson, "Reliability and Degradation Mechanism of AlGaN/GaN HEMTs for Next Generation Mobile Communication Systems.", Proc. of ROCS workshop, pp. 25-45, Monterrey, CA, USA, 2008
-
(2008)
Proc. of ROCS workshop
, pp. 25-45
-
-
Dammann, M.1
Pletschen, W.2
Waltereit, P.3
Bronner, W.4
Quay, R.5
Müller, S.6
Mikulla, M.7
Ambacher, O.8
van der Wei, P.9
Murad, S.10
Rödle, T.11
Behtash, R.12
Bourgeois, F.13
Riepe, K.14
Fagerlind, M.15
Sveinbjörnsson, E.16
-
8
-
-
72449139904
-
-
S.Y. Park, Carlo Floresca, Uttiya Chowdhury, Jose L. Jimenez, Cathy Lee, Edward Beam, Paul Saunier, Tony Balistreri, Moon J. Kim, Physical degradation of GaN HEMT devices under high drain bias reliability testing,
-
S.Y. Park, Carlo Floresca, Uttiya Chowdhury, Jose L. Jimenez, Cathy Lee, Edward Beam, Paul Saunier, Tony Balistreri, Moon J. Kim, "Physical degradation of GaN HEMT devices under high drain bias reliability testing",
-
-
-
-
9
-
-
34748867887
-
Degradation-mode analysis for highly reliable GaN-HEMT
-
Y. Inoue, S. Masuda, M. Kanamura, T. Ohki, K. Makiyama, N. Okamoto, K. Imanishi, T. Kikkawa, N. Hara, H. Shigematsu, and K. Joshin, "Degradation-mode analysis for highly reliable GaN-HEMT," IEEE MTT-S Int. Microwave Symp. Dig., pp. 639 - 642, 2007.
-
(2007)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 639-642
-
-
Inoue, Y.1
Masuda, S.2
Kanamura, M.3
Ohki, T.4
Makiyama, K.5
Okamoto, N.6
Imanishi, K.7
Kikkawa, T.8
Hara, N.9
Shigematsu, H.10
Joshin, K.11
-
10
-
-
34250730806
-
Impact of A1N interlayer on reliability of AlGaN/GaN HEMTs
-
R. Coffie, Y. Chen, I. P. Smorchkova, M. Wojtowicz, Y. C. Chou, B. Heying, and A. Oki, "Impact of A1N interlayer on reliability of AlGaN/GaN HEMTs," in Proc. IEEE Int. Rel. Phys. Symp. pp. 99-102, 2006.
-
(2006)
Proc. IEEE Int. Rel. Phys. Symp
, pp. 99-102
-
-
Coffie, R.1
Chen, Y.2
Smorchkova, I.P.3
Wojtowicz, M.4
Chou, Y.C.5
Heying, B.6
Oki, A.7
-
11
-
-
33846276942
-
Reliability of compound semiconductor workshop historical review
-
Palm Springs, CA, USA
-
W.J. Roesch, "Reliability of compound semiconductor workshop historical review", Proc. of ROCS workshop, pp. 1-17, Palm Springs, CA, USA, 2005
-
(2005)
Proc. of ROCS workshop
, pp. 1-17
-
-
Roesch, W.J.1
-
12
-
-
72449206475
-
Performance stability of AlGaN/GaN HFET: Effect of plasma processing
-
T. Baksht, Y. Knafo, I. Yehuda, and G Bunin, "Performance stability of AlGaN/GaN HFET: effect of plasma processing", Phys. Stat. Sol. (c) 5, No. 6, pp.2033-2036, 2008
-
(2008)
Phys. Stat. Sol. (c)
, vol.5
, Issue.6
, pp. 2033-2036
-
-
Baksht, T.1
Knafo, Y.2
Yehuda, I.3
Bunin, G.4
-
13
-
-
84887419193
-
Thermal and Piezoelectric Stress in Operating AlGaN/GaN HFET Devices and Effect of the Fe Doping in the GaN Buffer Layer
-
Tampa, Florida
-
A. Sarua, T. Batten, H. Ji, M. J. Uren, T. Martin M. Kuball," Thermal and Piezoelectric Stress in Operating AlGaN/GaN HFET Devices and Effect of the Fe Doping in the GaN Buffer Layer", in in Proc. ManTech conf, Tampa, Florida, 2009.
-
(2009)
in Proc. ManTech conf
-
-
Sarua, A.1
Batten, T.2
Ji, H.3
Uren, M.J.4
Martin, T.5
Kuball, M.6
|