SCOPUS 정보 검색 플랫폼

Journal of the Electrochemical Society

Volumn 157, Issue 1, 2010, Pages

Silane decomposition on Cu interconnects inhibited by ammonia

(3) Ryan, E Todd a Molis, Steven a Grill, Alfred b

a IBM MICROELECTRONICS (United States)

b IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA CONCENTRATIONS; COPPER INTERCONNECTS; COPPER SILICIDE; COPPER SURFACE; CU-INTERCONNECTS; IMPURITIES IN; INTERFACE MODIFICATION; NANO SCALE; SILICIDATION;

AMMONIA; CHEMICAL MODIFICATION; OPTICAL INTERCONNECTS; SILANES; SILICIDES; SILICON NITRIDE;

COPPER;

EID: 72249102395 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3253543 Document Type: Article

Times cited : (2)

References (17)

1
- 0031256176
- W. W. Lee and P. S. Ho, MRS Bull., 22, 19 (1997).
- (1997) MRS Bull. , vol.22 , pp. 19
- Lee, W.W.¹ Ho, P.S.²

2
- 0037666297
- 10.1063/1.1567460
- K. Maex, M. R. Baklanov, D. Shamiryan, F. Iacopi, S. H. Brongersma, and Z. S. Yanovitskaya, J. Appl. Phys., 93, 8793 (2003). 10.1063/1.1567460
- (2003) J. Appl. Phys. , vol.93 , pp. 8793
- Maex, K.¹ Baklanov, M.R.² Shamiryan, D.³ Iacopi, F.⁴ Brongersma, S.H.⁵ Yanovitskaya, Z.S.⁶

3
- 34547213393
- C.-K. Hu, D. Canaperi, S. T. Chen, L. M. Gignac, B. Herbst, and S. Kaldor, in IEEE 42nd International Reliability Physics Symposium, p. 222 (2004).
- (2004) IEEE 42nd International Reliability Physics Symposium , pp. 222
- Hu, C.-K.¹ Canaperi, D.² Chen, S.T.³ Gignac, L.M.⁴ Herbst, B.⁵ Kaldor, S.⁶

4
- 85013613367
- C.-K. Hu, R. Rosenberg, H. S. Rathore, D. B. Nguyen, and B. Agarwala, in IEEE 1999 International Interconnect Technology Conference, p. 267 (1999).
- (1999) IEEE 1999 International Interconnect Technology Conference , pp. 267
- Hu, C.-K.¹ Rosenberg, R.² Rathore, H.S.³ Nguyen, D.B.⁴ Agarwala, B.⁵

5
- 0037323106
- 10.1063/1.1532942
- M. W. Lane, E. G. Liniger, and J. R. Lloyd, J. Appl. Phys., 93, 1417 (2003). 10.1063/1.1532942
- (2003) J. Appl. Phys. , vol.93 , pp. 1417
- Lane, M.W.¹ Liniger, E.G.² Lloyd, J.R.³

6
- 0000185264
- 10.1063/1.367235
- S. Hymes, K. S. Kumar, S. P. Murarka, P. J. Ding, W. Wang, and W. A. Lanford, J. Appl. Phys., 83, 4507 (1998). 10.1063/1.367235
- (1998) J. Appl. Phys. , vol.83 , pp. 4507
- Hymes, S.¹ Kumar, K.S.² Murarka, S.P.³ Ding, P.J.⁴ Wang, W.⁵ Lanford, W.A.⁶

7
- 0008902674
- 10.1116/1.572362
- L. H. Dubois and R. G. Nuzzo, J. Vac. Sci. Technol. A, 2, 441 (1984). 10.1116/1.572362
- (1984) J. Vac. Sci. Technol. A , vol.2 , pp. 441
- Dubois, L.H.¹ Nuzzo, R.G.²

8
- 0344951989
- 10.1016/S0039-6028(85)80017-0
- R. G. Nuzzo and L. H. Dubois, Surf. Sci., 149, 119 (1985). 10.1016/S0039-6028(85)80017-0
- (1985) Surf. Sci. , vol.149 , pp. 119
- Nuzzo, R.G.¹ Dubois, L.H.²

9
- 0001164979
- 10.1021/j100146a033
- B. C. Wiegand, S. P. Lohokare, and R. G. Nuzzo, J. Phys. Chem., 97, 11553 (1993). 10.1021/j100146a033
- (1993) J. Phys. Chem. , vol.97 , pp. 11553
- Wiegand, B.C.¹ Lohokare, S.P.² Nuzzo, R.G.³

10
- 34249914706
- L. G. Gosset, V. Arnal, S. Chhun, N. Casanova, M. Mellier, J.-Ph. Reynard, X. Federspiel, J.-F. Guillaumond, L. Arnaud, and J. Torres, in Proceedings of the 2003 Advanced Metallization Conference, p. 231 (2003).
- (2003) Proceedings of the 2003 Advanced Metallization Conference , pp. 231
- Gosset, L.G.¹ Arnal, V.² Chhun, S.³ Casanova, N.⁴ Mellier, M.⁵ Reynard, J.-Ph.⁶ Federspiel, X.⁷ Guillaumond, J.-F.⁸ Arnaud, L.⁹ Torres, J.¹⁰

11
- 28044466903
- 10.1016/j.mee.2005.07.061
- S. Chhun, L. G. Gosset, N. Casanova, D. Ney, D. Delille, C. Trouiller, M. Hopstaken, P. Chausse, M. Gregoire, B. Gautier, Microelectron. Eng., 82, 587 (2005). 10.1016/j.mee.2005.07.061
- (2005) Microelectron. Eng. , vol.82 , pp. 587
- Chhun, S.¹ Gosset, L.G.² Casanova, N.³ Ney, D.⁴ Delille, D.⁵ Trouiller, C.⁶ Hopstaken, M.⁷ Chausse, P.⁸ Gregoire, M.⁹ Gautier, B.¹⁰

12
- 34249894732
- Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
- DOI 10.1149/1.2736655
- E. T. Ryan, J. Martin, G. Bonilla, S. Molis, T. Spooner, J. Widodo, J.-H. Kim, E. Liniger, A. Grill, and C.-K. Hu, J. Electrochem. Soc., 154, H604 (2007). 10.1149/1.2736655 (Pubitemid 46872270)
- (2007) Journal of the Electrochemical Society , vol.154 , Issue.7
- Ryan, E.T.¹ Martin, J.² Bonilla, G.³ Molis, S.⁴ Spooner, T.⁵ Widodo, J.⁶ Kim, J.-H.⁷ Liniger, E.⁸ Grill, A.⁹ Hu, C.-K.¹⁰

13
- 0003720630
- 2nd ed., McGraw-Hill, New York
- M. Hansen and K. Anderko, Constitution of Binary Alloys, 2nd ed., McGraw-Hill, New York (1958).
- (1958) Constitution of Binary Alloys
- Hansen, M.¹ Anderko, K.²

14
- 0003429729
- McGraw-Hill, New York
- F. J. Blatt, Physics of Electronic Conduction in Solids, McGraw-Hill, New York (1968).
- (1968) Physics of Electronic Conduction in Solids
- Blatt, F.J.¹

15
- 0033990021
- 10.1557/JMR.2000.0033
- M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, J. Mater. Res., 15, 203 (2000). 10.1557/JMR.2000.0033
- (2000) J. Mater. Res. , vol.15 , pp. 203
- Lane, M.¹ Krishna, N.² Hashim, I.³ Dauskardt, R.H.⁴

16
- 0001291359
- 10.1063/1.350765
- S. Hymes, S. P. Murarka, C. Shepard, and W. A. Lanford, J. Appl. Phys., 71, 4623 (1992). 10.1063/1.350765
- (1992) J. Appl. Phys. , vol.71 , pp. 4623
- Hymes, S.¹ Murarka, S.P.² Shepard, C.³ Lanford, W.A.⁴

17
- 0025471333
- 3Si. Marker experiments
- DOI 10.1016/0040-6090(90)90455-M
- L. Stolt and F. M. D'Heurle, Thin Solid Films, 189, 269 (1990). 10.1016/0040-6090(90)90455-M (Pubitemid 20734614)
- (1990) Thin Solid Films , vol.189 , Issue.2 , pp. 269-274
- Stolt, L.¹ D'Heurle, F.M.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.