Thermal stability of copper suicide passivation layers in copper-based multilevel interconnects

Journal of Applied Physics

Volumn 83, Issue 8, 1998, Pages 4507-4512

  Hymes, S ^a   Kumar, K S ^a   Murarka, S P ^a   Ding, P J ^b   Wang, W ^b   Lanford, W A ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000185264     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.367235     Document Type: Article

References (18)

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