Thermal conductivity and specific heat determinations of a set of lead-free solder alloys

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 203-208

  Kehoe, L ^a   Crean, G M ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INTERFACES (MATERIALS); LEAD ALLOYS; PACKAGING MATERIALS; SOLDERED JOINTS; SPECIFIC HEAT; THERMAL CONDUCTIVITY OF SOLIDS; TIN ALLOYS; LASER APPLICATIONS; NUMERICAL ANALYSIS; QUALITY CONTROL; RELIABILITY; SOLDERING ALLOYS; THERMAL VARIABLES MEASUREMENT;

ELECTRONICS MANUFACTURING; LASER FLASH TECHNIQUES; LEAD-BASED SOLDERS; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MEASUREMENTS OF;

LEAD-FREE SOLDERS; ELECTRONICS PACKAGING;

BLACKBODY RADIATION; HEAT CAPACITY; HEAT EQUATIONS; LASER FLASH TECHNIQUE; LEAD FREE SOLDERS;

EID: 0032230537     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664460     Document Type: Conference Paper

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