Solvent assisted bonding of polymethylmethacrylate: Characterization using the response surface methodology

Sensors and Actuators, A: Physical

Volumn 156, Issue 1, 2009, Pages 121-128

  Umbrecht, F ^a   Muller D ^a   Gattiker, F ^b   Boutry, C M ^a   Neuenschwander, J ^b   Sennhauser, U ^b   Hierold, Ch ^a  

^a ETH ZURICH   (Switzerland)

^b SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Bond strength; Microchannel deformation; Microchannel fabrication; Response surface methodology; Solvent bonding PMMA

Indexed keywords

BOND STRENGTH; BONDING PROCESS; CENTER POINTS; FABRICATION PROCESS; LOW ASPECT RATIO; MICROCHANNEL FABRICATION; NOVEL SOLVENTS; PROCESS PARAMETERS; RESPONSE SURFACE METHODOLOGY; SOLVENT BONDING; STRAIN SENSORS; ULTRASOUND MEASUREMENT;

ASPECT RATIO; BOND STRENGTH (MATERIALS); DEFORMATION; FABRICATION; POLYESTERS; PRESSURE DROP; SOLVENTS; SURFACE PROPERTIES;

MICROCHANNELS;

EID: 71649112951     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.03.028     Document Type: Article

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