Parameter optimization method for fabricating 3D microstructures embedded in single-layer negative-tone photoresist

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 1616-1619

  Hirai, Y ^a   Sugano, K ^a   Tsuchiya, T ^a   Tabata, O ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

3 dimensional microstructuring; Embedded microchannel; Thick film photoresist

Indexed keywords

3-DIMENSIONAL; 3D MICROSTRUCTURES; A-THERMAL; CHEMICAL BEHAVIOR; CROSS-LINKING PROCESS; EMBEDDED MICROCHANNELS; MICRO STRUCTURING; NEGATIVE TONES; OPTIMIZATION METHOD; OPTIMUM PARAMETERS; PARAMETER OPTIMIZATION METHODS; PARAMETER SET; POSTEXPOSURE BAKE; PROCESS PARAMETERS; SINGLE LAYER; UV EXPOSURE; UV LITHOGRAPHY TECHNIQUES;

ACTUATORS; HEAT TREATMENT; LITHOGRAPHY; MICROCHANNELS; MICROSTRUCTURE; MICROSYSTEMS; PHOTORESISTORS; PHOTORESISTS; PIEZOELECTRIC TRANSDUCERS; STRUCTURAL OPTIMIZATION; SURFACE TREATMENT;

SOLID-STATE SENSORS;

EID: 71449094514     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285769     Document Type: Conference Paper

References (7)

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