Effects of substrate temperature on the surface of polymer thin films prepared by R.F. sputtering with a polyimide target

Vacuum

Volumn 84, Issue 5, 2009, Pages 607-611

  Uemura, Akihiro ^a   Kezuka, Kazuya ^a   Iwamori, Satoru ^a   Nishiyama, Itsuo ^b  

^a KANAZAWA UNIVERSITY   (Japan)

^b Daipla Wintes Co Ltd   (Japan)

Author keywords

Adhesion strength; Friction; Polyimide; R.F. sputtering; Thin film; Wear

Indexed keywords

ADHESION PROPERTIES; ADHESION STRENGTH; ADHESION STRENGTHS; COPPER SUBSTRATES; FRICTION COEFFICIENTS; HEATING EFFECT; NITROGEN GAS; POLYMER THIN FILMS; PULL STRENGTH; R.F. SPUTTERING; RADIO FREQUENCY SPUTTERING; ROOM TEMPERATURE; SPUTTERED THIN FILMS; SUBSTRATE TEMPERATURE;

ADHESION; ARGON; BOND STRENGTH (MATERIALS); COPPER; DURABILITY; FRICTION; HEATING; INORGANIC COATINGS; NITROGEN; PLASTIC FILMS; POLYIMIDES; POLYMER FILMS; SUBSTRATES; SURFACE ROUGHNESS; THIN FILM DEVICES; THIN FILMS; TRIBOLOGY; VAPOR DEPOSITION;

FILM PREPARATION;

EID: 70649094016     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2009.06.036     Document Type: Article

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