3-D ICs enter commercialization

Semiconductor International

Volumn 31, Issue 12, 2008, Pages 44-49

  Garrou, Philip ^a  

^a Microelectronic Consultants of North Carolina   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 57249105440     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (18)

1. P. Garrou, "3-D IC Integration: Evolution or Revolution?", Perspectives From the Leading Edge, www.semiconductor.net/perspectives, March 16, 2008.
2. P. Garrou, "3-D Practitioners Assemble at Fort McDowell," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, March 23, 2008.
3. P. Garrou, "Imaging Chips With TSV Announced for Commercialization," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, Oct 27, 2007.
4. P. Garrou, "STMicro Announces More CMOS Image Sensor Packaging Capacity With TSV," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, March 5, 2008.
5. P. Garrou, "Road Trip Revelations," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, May 18, 2008.
6. R Garrou, "SMTA 3-D Meeting in Research Triangle Park," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, May 10, 2008.
7. Intel 300 mm.
8. P. Morrow et al., "Design and Fabrication of 3D Microprocessors, " MRS Proc., Vol. 970, 2007, p. 91.
9. P. Garrou, "COSMOS," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, April 19, 2008.
10. P. Garrou, "Sonne Things Need Repeating...," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, Sept. 29, 2007
11. P. Garrou, "Foundry TSVs Are a Comin' - TSMC Makes Their Play for a Bigger Portion of the Pie," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, May 2, 2008.
12. P. Garrou, "3-D Road Tour Cont.," Perspectives From the Leading Edge, www.semiconductor.net/perspectives. May 28, 2008.
13. P. Garrou, "3-D Discussions in the Valley... Cont.," Perspectives From the Leading Edge, www.semiconduotor.net/perspectives, Nov. 4, 2007.
14. P. Garrou, "More 3-D IC Integration From Fort McDowell," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, March 30, 2008.
15. P. Garrou, "3-D Equipment and Materials Vendors Consortium," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, Aug. 26, 2007.
16. P. Garrou, "IMEC Arrives In Hsinchu and Other 3-D IC News," Perspectives From the Leading Edge, www.semlconductor.net/perspectives, Feb. 26, 2008.
17. P. Garrou, "3-D IC Integration: Rumors and Ruminations," Perspectives From the Leading Edge, www.semiconductor.net/perspectives, Feb. 8, 2008.
18. P. Garrou, "$50 3-D Bonding Coming; Intel Announces '...We Are Ready,'" Perspectives From the Leading Edge, www.semiconductor.net/ perspectlves, Oct. 29, 2007.