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Volumn 87, Issue 2, 2010, Pages 200-207
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Deformation behavior of solid polymer during hot embossing process
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Author keywords
Finite element simulation; Hot embossing; Polymer deformation behavior; Synchronous observation
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Indexed keywords
APPLYING PRESSURE;
DEFORMATION BEHAVIOR;
DEFORMATION OF SOLIDS;
FINITE ELEMENT SIMULATIONS;
HOT EMBOSSING PROCESS;
HOT-EMBOSSING;
MICRO DEVICES;
PHENOMENOLOGICAL MODELS;
POLYMER BASED;
POLYMER DEFORMATION;
RECOVERY STAGES;
SOLID POLYMERS;
SYNCHRONOUS OBSERVATIONS;
TWO STAGE;
FINITE ELEMENT METHOD;
POLYMERS;
SHEET MOLDING COMPOUNDS;
SIMULATORS;
STEAM CONDENSATE;
STRAIN HARDENING;
STRESS CONCENTRATION;
DEFORMATION;
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EID: 70450285211
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2009.07.014 Document Type: Article |
Times cited : (55)
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References (15)
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