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Volumn 87, Issue 2, 2010, Pages 200-207

Deformation behavior of solid polymer during hot embossing process

Author keywords

Finite element simulation; Hot embossing; Polymer deformation behavior; Synchronous observation

Indexed keywords

APPLYING PRESSURE; DEFORMATION BEHAVIOR; DEFORMATION OF SOLIDS; FINITE ELEMENT SIMULATIONS; HOT EMBOSSING PROCESS; HOT-EMBOSSING; MICRO DEVICES; PHENOMENOLOGICAL MODELS; POLYMER BASED; POLYMER DEFORMATION; RECOVERY STAGES; SOLID POLYMERS; SYNCHRONOUS OBSERVATIONS; TWO STAGE;

EID: 70450285211     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.07.014     Document Type: Article
Times cited : (55)

References (15)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.