Effects of the matrix shrinkage and filler hardness on the thermal conductivity of TCA

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 851-855

  Yue, Cong ^a   Zhang, Yan ^a   Hu, Zhili ^a   Liu, Johan ^a,b   Cheng, Zhaonian ^a  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CELL MODEL; CONDUCTIVE ADHESIVE; CONTACT AREAS; CURING PROCESS; FILLER PARTICLES; MATRIX SHRINKAGE; THERMAL INTERFACE MATERIALS; TWO PARTICLES;

ELECTRONICS PACKAGING; ORGANIC POLYMERS; PACKAGING; SHRINKAGE; SILICONES; SILVER; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS;

FILLERS;

EID: 70450210475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270540     Document Type: Conference Paper

References (10)

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