Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion

Image and Vision Computing

Volumn 28, Issue 3, 2010, Pages 491-501

  Tsai, Du Ming ^a   Chang, Chih Chieh ^a   Chao, Shin Min ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

Anisotropic diffusion; Defect detection; Heterogeneous texture; Micro crack; Solar wafer

Indexed keywords

COMPUTER VISION; CRACKS; DIFFUSION; INSPECTION; MATHEMATICAL MORPHOLOGY; OPTICAL ANISOTROPY; POLYSILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TEXTURES; VISUAL COMMUNICATION;

ADAPTIVE SMOOTHING; ANISOTROPIC DIFFUSION; AUTOMATED VISUAL INSPECTION; DEFECT DETECTION; DIFFERENCE IMAGES; DIFFUSION COEFFICIENTS; DIFFUSION MODEL; FAST COMPUTATION; GRAY-LEVEL; HIGH GRADIENT; LIGHT ILLUMINATION; MACHINE VISION; MAIN CHARACTERISTICS; MORPHOLOGICAL OPERATIONS; MULTI-GRAIN; ORIGINAL IMAGES; POLYCRYSTALLINE SILICON WAFERS; SENSED IMAGE; TEST SETS; THRESHOLDING; WAFER IMAGES; WAFER MANUFACTURING;

CRACK DETECTION;

EID: 70449699697     PISSN: 02628856     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.imavis.2009.08.001     Document Type: Article

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