SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 107-119

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

(5) Huffman, Alan a Lannon, John a Lueck, Matthew a Gregory, Christopher a Temple, Dorota a

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BONDING INTERFACES; BONDING PROCESS; CHEMICAL NATURE; DRIVING FORCES; ELECTRICAL CONNECTION; ELECTRICAL MEASUREMENT; ELECTRICAL RESISTANCES; FABRICATION PROCESS; HIGH RESOLUTION; INTEGRATED DEVICE; INTEGRATED ELECTRONICS; INTERCONNECT DENSITIES; INTERCONNECT STRUCTURES; LARGE AREA ARRAYS; LONG TERM STABILITY; LOW RESISTANCE; MECHANICAL PERFORMANCE; MECHANICAL STRENGTH; METAL PAD; OPTOELECTRONIC COMPONENTS; SEM ANALYSIS; SHEAR TESTING; SILICON LAYER; SN BUMPS; SOLID-LIQUID; TEST STRUCTURE; THERMAL EXPOSURE; THERMO COMPRESSION BONDING;

CHEMICAL STABILITY; ELECTRIC CONNECTORS; METALS; OPTICAL INTERCONNECTS; SURFACE CHEMISTRY; SURFACE TOPOGRAPHY; THREE DIMENSIONAL; TIN;

STRUCTURAL METALS;

EID: 70449602573 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (19)

References (8)

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3
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4
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- (2004) Jap. J. of Appl. Phys , vol.43 , Issue.4 B , pp. 2264-2270
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5
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.