Advances in 3-D integration of heterogeneous materials and technologies

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6544, Issue , 2007, Pages

  Temple, D ^a   Lannon, J M ^a   Malta, D ^a   Robinson, J E ^b   Coffman, P R ^b   Welch, T B ^b   Skokan, M R ^b   Moll, A J ^c   Knowlton, W B ^c  

^a RTI INTERNATIONAL   (United States)

^b DRS Sensors and Targeting Systems Inc   (United States)

^c BOISE STATE UNIVERSITY   (United States)

Author keywords

3 D integration; FPA; IC stacking; IR scene projector; MEMS; Microbolometer; Resistive IR emitter; Vertical interconnects

Indexed keywords

3-D INTEGRATION; IC STACKING; IR SCENE PROJECTOR; MICROBOLOMETER; RESISTIVE IR EMITTER; VERTICAL INTERCONNECTS;

FOCAL PLANE ARRAYS; MEMS; MILITARY APPLICATIONS; THREE DIMENSIONAL;

MICROSYSTEMS;

EID: 35948942696     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.722502     Document Type: Conference Paper

References (5)

1. nd Conference on 3D Architectures for Semiconductor Integration and Packaging, Tempe, AZ, 2005.
2. J.E. Robinson, L. Wood, T. Murphy, P. Coffman, D. Temple, D. Malta, and C.A. Bower, "Vertically Interconnected Sensor Array (VISA) Technology for High Operating Temperature HgCdTe FPAs," Vertically Integrated Sensor Arrays I, Proc. of GOMACTech-05, 359-362, 2005.
3. S. Horn, P. Norton, J. Murphy K. Carson, R. Eden, and R. Clement, "Vertically-integrated sensor arrays," Proc. of Military Sensing Symposia, Tucson, AZ 2004.
4. D. Temple, D. Malta, B.R. Stoner, C.A. Bower, P.R. Coffman, and J.E. Robinson, "High Density 3-D Interconnect Technology for Massively Parallel Signal Processing in Infrared Focal Plane Arrays," Vertically Integrated Sensor Arrays I, Proc. of GOMACTech-05, 363-366, 2005.
5. M. A. Kinch, "HDVIPTM FPA Technology at DRS," Infrared Technology and Applications XXVII, B.F. Andresen, G.F. Fulop, M. Strojnik editors. Proc. of SPIE Vol. 4369, 566-579, 2001.