Thermal effects of moisture inducing delamination in light-emitting diode packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6355, Issue , 2006, Pages

  Jianzheng, Hu ^a   Lianqiao, Yang ^a   Moo, Whan Shin ^a  

^a Myong Ji University   (South Korea)

Author keywords

Delamination; Light emitting diode; Moisture; Thermal resistance

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT RESISTANCE; MOISTURE; THERMAL EFFECTS;

HYGRO-MECHANICAL STRESS; MICROGRAPHICAL EVIDENCE; PRECONDITIONING TIME;

LIGHT EMITTING DIODES;

EID: 33845682985     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.691555     Document Type: Conference Paper

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