Adhesion characteristics of underfill material with various package components after plasma and UV/ozone treatments

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 208-215

  Sham, Man Lung ^a   Lam, Mei ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; CONTACT ANGLE; DELAMINATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PASSIVATION; POLYIMIDES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SHEAR FLOW; SILICON NITRIDE; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION CHARACTERISTIC; FUNCTIONAL PERFORMANCE; INTERFACIAL BOND STRENGTH; SILICON NITRIDE PASSIVATION; SPREADING COEFFICIENTS; SURFACE CHARACTERISTICS; THERMODYNAMIC PARAMETER; UNDERFILL MATERIALS;

MODIFIED ATMOSPHERE PACKAGING;

EID: 70350304323     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983986     Document Type: Conference Paper

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