Role of adhesion and its reliability implications in electronic assemblies

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 28-34

  Viswanadham, P ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Adhesives; Assembly; Bonding; Chemicals; Chip scale packaging; Electronics packaging; Joining materials; Polymers; Semiconductor device packaging; Space technology

Indexed keywords

ADHESION; ADHESIVES; ASSEMBLY; BONDING; CHEMICALS; COATINGS; ELECTRONICS PACKAGING; JOINING; MANUFACTURE; PLASTIC COATINGS; POLYMERS; SEMICONDUCTOR DEVICES;

CHIP-SCALE PACKAGING; ELECTRONIC ASSEMBLIES; JOINING MATERIALS; OPERATING ENVIRONMENT; PHYSICOCHEMICAL CHARACTERISTICS; POLYMER-POLYMER INTERFACES; SEMICONDUCTOR DEVICE PACKAGING; SPACE TECHNOLOGIES;

CHIP SCALE PACKAGES;

EID: 33751405909     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860568     Document Type: Conference Paper

References (4)

1. K. W. Lee and A. Viehbeck, Wet Process Surface Modification Dielectric Polymers Adhesion Enhancements and Metallization, IBM. J. res. Develop. vol. 38, #4, pp.457-474, 1994.
2. Puligandla Viswanadham and Pratap Singh, Failure Modes and Mechanisms in Electronic Packaging, chap.2.,pp.13, Chapman and Hall, 1998.
3. J. H. Nara, D. Gasprani, J. Andrews, C. Briggs, Mechanical Properties of Steel-to-Steel Adhesive Bonds, ch.3. Report.#FHWA/OH-86/017, PB88-111299AS, November 86.
4. Y.W. Huang, K.H.Teo, K.L.Chua, M.W.R. Yang, W. Ferns, "The Effect of Underfill on the Pressure Cooker Test Performance of Flip Chip on Board Assembly", Advances in Electronic Packaging - 1999, vol.26 -2: pp. 1121-1127, ASME, 1999.