Hardware/software co-design architecture for thermal management of chip multiprocessors

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2009, Pages 952-957

  Khan, Omer ^a   Kundu, Sandip ^a  

^a University of Massachusetts   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC FREQUENCY SCALING; HARDWARE-SOFTWARE CODESIGN; MULTIPROCESSING SYSTEMS; TEMPERATURE CONTROL; VOLTAGE SCALING;

ARCHITECTURAL SOLUTIONS; CHIP MULTIPROCESSOR; DYNAMIC VOLTAGE AND FREQUENCY SCALING; HETEROGENEOUS PROCESSING; HIGH PERFORMANCE COMPUTING; INSTRUCTION LEVEL PARALLELISM; THERMAL EMERGENCIES; THERMAL MANAGEMENT SYSTEMS;

THERMAL MANAGEMENT (ELECTRONICS);

EID: 70350070731     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/date.2009.5090802     Document Type: Conference Paper

References (21)

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