Temperature and strain rate effects on the strength and ductility of nanostructured copper

Applied Physics Letters

Volumn 83, Issue 15, 2003, Pages 3165-3167

  Wang, Y M ^a   Ma, E ^a  

^a Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DUCTILITY; STRAIN HARDENING; STRAIN RATE; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; YIELD STRESS;

THERMAL ACTIVATION;

NANOSTRUCTURED MATERIALS;

EID: 0242272649     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1618370     Document Type: Article

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