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Volumn 18, Issue 5, 2009, Pages 1054-1061

Characterization of high-pressure XeF2 vapor-phase silicon etching for MEMS processing

Author keywords

Cantilever(s); Gas; Roughness; Si etching; Underetching; XeF2; Xenon difluoride

Indexed keywords

CANTILEVER(S); ROUGHNESS; SI ETCHING; UNDERETCHING; XEF2; XENON DIFLUORIDE;

EID: 70349984524     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2029976     Document Type: Article
Times cited : (23)

References (9)
  • 2
    • 3042819309 scopus 로고    scopus 로고
    • Modeling and characterization of sacrificial polysilicon etching using vapor-phase xenon difluoride
    • J. D. Brazzle, M. R. Dokmeci, and C. H. Mastrangelo, "Modeling and characterization of sacrificial polysilicon etching using vapor-phase xenon difluoride," in Proc. 17th IEEE Int. Conf. MEMS, 2004, pp. 737-740.
    • (2004) Proc. 17th IEEE Int. Conf. MEMS , pp. 737-740
    • Brazzle, J.D.1    Dokmeci, M.R.2    Mastrangelo, C.H.3
  • 4
    • 0030674571 scopus 로고    scopus 로고
    • Thin beam bulk micromachining based on RIE and xenon difluoride silicon etching
    • Chicago, IL
    • R. Toda, K. Minami, and M. Esashi, "Thin beam bulk micromachining based on RIE and xenon difluoride silicon etching," in Proc. Int. Conf. Solid State Sens. Actuators, TRANSDUCERS, Chicago, IL, 1997, vol. 1, pp. 671-674.
    • (1997) Proc. Int. Conf. Solid State Sens. Actuators, TRANSDUCERS , vol.1 , pp. 671-674
    • Toda, R.1    Minami, K.2    Esashi, M.3
  • 6
    • 0742286720 scopus 로고    scopus 로고
    • Etch rates for micromachining processing - Part II
    • Dec
    • K. R. Williams, K. Gupta, and M. Wasilik, "Etch rates for micromachining processing - Part II," J. Microelectromech. Syst., vol. 12, no. 6, pp. 761-778, Dec. 2003.
    • (2003) J. Microelectromech. Syst , vol.12 , Issue.6 , pp. 761-778
    • Williams, K.R.1    Gupta, K.2    Wasilik, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.