Characterization of deep wet etching of fused silica glass for single cell and optical sensor deposition

Journal of Micromechanics and Microengineering

Volumn 19, Issue 6, 2009, Pages

  Zhu, Haixin ^a   Holl, Mark ^a   Ray, Tathagata ^a   Bhushan, Shivani ^a   Meldrum, Deirdre R ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP WET ETCHING; ETCH DEPTH; ETCH RATES; FUSED SILICA GLASS; FUSED SILICA SUBSTRATES; HIGH-THROUGHPUT; IMPURITY CONCENTRATION; MASKING LAYERS; MASKING MATERIAL; METABOLIC RATES; OPTICAL TRANSPARENCY; PIN HOLES; PROCESS TECHNIQUES; PROCESS YIELD; ROOM TEMPERATURE; SILICON MICROMACHINING; SINGLE CELLS; SINGLE-CELL TRAPPING; SURFACE QUALITIES; TRANSPARENT SUBSTRATE; WELL ARRAY; WET-ETCH;

CELL MEMBRANES; CHEMICAL REACTIONS; CHEMICAL RESISTANCE; COATED MATERIALS; ETCHING; HYDROFLUORIC ACID; MICROMACHINING; OXIDES; PHOTORESISTS; SENSORS; SILICA; SUBSTRATES; SURFACE ROUGHNESS;

FUSED SILICA;

EID: 70349970824     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/6/065013     Document Type: Article

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