Impact of direct CMP on porous ULK properties and interconnect propagation performance on a wide frequency bandwidth

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 423-429

  Gallitre, Michel ^a,b   Gall, Samuel ^c   Farcy, Alexis ^a   Blampey, Benjamin ^b   Icard, Béatrice ^c   Jousseaume, Vincent ^c   Guillermet, Marc ^c   Brun, Philippe ^a   Zenasni, Aziz ^c   Grosgeorges, Patrick ^c   Sbrugnera, Vanessa ^b   Bustos, Jessy ^a   Bermond, Cédric ^b   Lacrevaz, Thierry ^b   Fléchet, Bernard ^b   Rivoire, Maurice ^c   Ancey, Pascal ^a  

^a STMICROELECTRONICS   (France)

^b UNIVERSITÉ DE SAVOIE   (France)

^c CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT CMP; FREQUENCY BAND WIDTH; HARD MASKS; HIGH-FREQUENCY CHARACTERIZATION; INTEGRATION SCHEME; INTERCONNECT PERFORMANCE; K-VALUE; MOISTURE UPTAKE; MULTI LEVEL INTERCONNECTS; NEW TECHNOLOGIES; ORGANIC CONTAMINATION; PERFORMANCE SPECIFICATIONS; POROUS DIELECTRICS; POROUS ULK; ULK MATERIALS;

DIELECTRIC LOSSES; METALLIZING; NANOTECHNOLOGY;

DIELECTRIC MATERIALS;

EID: 70349957887     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. International Technology Roadmap for Semiconductors (ITRS), 2006 edition.
2. S. Kondo, B.U. Yoon, S.G. Lee, S. Tokitoh, K. Misawa, T. Yoshie, N. Ohashi, N. Kobayashi, Digest of technical papers of the VLSI Symposium 2004, pp. 68-69.
3. S. Gall, C. Euvrard, S. Petitdidier, M.Rivoire, F. Durix, Proceedings of CMP-MIC 2008, pp. 17-24.
4. M. Aimadeddine, V. Jousseaume, V. Arnal, L. Favennec, A. Farcy, A. Zenasni, M. Assous, M. Vilmay, S. Jullian, P. Maury, V. Delaye, N. Jourdan, T. Vanypre, P. Brun, G. Imbert, Y. LeFriec, M. Mellier, H. Chaabouni, K. Hamioud, F. Volpi, D. Louis, G. Passemard, J. Torres, Proceedings of IITC 2007, pp. 175-177.
5. R. Fox, O. Hinsinger, E. Richard, E. Sabouret, T. Berger, C. Goldberg, A. Humbert, G. Imbert, P. Brun, E. Ollier, C. Maurice, M. Guillermet, C. Monget, V. Plantier, H. Bono, M. Zaleski, M. Mellier, J.P. Jacquemin, J. Flake, B.G. Sharma, L. Broussous, A. Farcy, V. Arnal, R. Gonella, S. Maubert, V. Girault, P. Vannier, D. Reber, A. Schussler, J. Mueller, W. Besling, IEDM Technical Digest, pp. 81-84 (2005).
6. T-S. Kim, T. Konno, T. Yamanaka, R.H. Dauskardt, Proceedings of CMP-MIC 2008, pp. 21-26.
7. K. Jooyong and D.P. Neikirk, Electrical Performance of Electronic Packaging, pp. 93-96 (2003).
8. T. Lacrevaz, B. Fléchet, A. Farcy, J. Torres, M. Gros-Jean, C. Bermond, O. Cueto, B. Blampey, G. Angenieux, J. Piquet, F. De Crecy, Microelectronic Engineering 82, pp. 548-553, (2005).
9. S. de Rivaz, T. Lacrevaz, M. Gallitre, A. Farcy, B. Blampey, C. Bermond, B. Fléchet, Proceedings of SPI 2008, pp. 61-64.