Optimizing CMP for ultra-low-k dielectrics

2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008

Volumn , Issue , 2008, Pages 21-26

  Kim, Taek Soo ^a   Konno, Tomohisa ^b   Yamanaka, Tatsuya ^b   Dauskardt, Reinhold H ^a  

^a Stanford University   (United States)

^b JSR Micro   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL-MECHANICAL PLANARIZATION; CRITICAL FACTORS; DEFECT EVOLUTION; DEFECT GROWTH; HYDROPHILIC-LIPOPHILIC BALANCE; SOLUTION CHEMISTRY; TECHNOLOGY NODES; ULTRA-LOW-K DIELECTRICS;

DEFECTS; DIFFUSION; NONIONIC SURFACTANTS; OPTIMIZATION; ULSI CIRCUITS;

CHEMICAL MECHANICAL POLISHING;

EID: 84888263493     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. E. P. Guyer and R. H. Dauskardt. Effect of CMP slurry environments on subcriticai crack growth in ultra low-k dielectric materials. IEEE International Interconnect Technology Conference Proceedings, 89-91 (2003).
2. E. P. Guyer and R. H. Dauskardt. Fracture of nanoporous thin-film glasses. Nature Materials 3, 53-57 (2004).
3. T. Kim, Q. Zhong, M. Peterson, H. Tam, T. Konno, and R. H. Dauskardt. Stress and Slurry Chemistry Effects on CMP Damage of Ultra-Low-k Dielectrics. IEEE International Interconnect Technology Conference Proceedings, 129-131 (2007).
4. E. P. Guyer, J. Gantz, and R. H. Dauskardt. Aqueous solution diffusion in hydrophobic nanoporous min-film glasses. J. Mater. Res. 22,710-718 (2007).
5. P. G. de Germes. Reptation of a Polymer Chain in the Presence of Fixed Obstacles. J. Chem. Phys. 55,572-579(1971).