Intelligent image sensor chip with three dimensional structure

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1999, Pages 879-882

  Kurino, H ^a   Lee, K W ^a   Nakamura, T ^a   Sakuma, K ^a   Park, K T ^a   Miyakawa, N ^a   Shimazutsu, H ^a   Kim, K Y ^a   Inamura, K ^a   Koyanagi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; IMAGE PROCESSING; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; LSI CIRCUITS; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; SOLDERING; THREE DIMENSIONAL;

INTELLIGENT IMAGE SENSOR CHIP; THREE DIMENSIONAL INTEGRATION TECHNOLOGY; THREE DIMENSIONAL STRUCTURE; WAFER BONDING TECHNIQUE;

IMAGE SENSORS;

EID: 0033329320     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)