A fluxless bonding process using ausn or indium for a miniaturized hermetic package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 224-231

  Volpert, Marion ^a   Kopp, Christophe ^a   Routin, Julien ^a   Gasse, Adrien ^a   Bernabe, Stéphane ^a   Rossat, Cyrille ^b   Tournair, Myriam ^b   Hamelin, Régis ^b   Lecocq, Vincent ^b  

^a CEA GRENOBLE   (France)

^b INTEXYS PHOTONICS ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

BATCH PROCESS; FLUXLESS; FLUXLESS BONDING; HERMETIC PACKAGES; HERMETIC SEALING; HIGH-SPEED DATA TRANSMISSION; INDUSTRIALISATION; LEAK RATE; LEAK TESTS; MEMSDEVICES; RELIABILITY TEST; SEAL RINGS; SEALING RING; THERMO-COMPRESSION;

BATCH DATA PROCESSING; HELIUM; INDIUM; TIN ALLOYS;

SEALS;

EID: 70349678307     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074021     Document Type: Conference Paper

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