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Volumn , Issue , 2009, Pages 441-447

Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: From synthesis to assembly

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA LAYERS; CHEMICAL ANCHORING; CONTACT INTERFACE; CONTACT THERMAL RESISTANCE; COPPER SUBSTRATES; DIRECT SYNTHESIS; ELECTRONIC PACKAGING; GROWTH SUBSTRATES; HIGH QUALITY; HIGH TEMPERATURE; INTERFACE MODIFICATION; INTERFACIAL ADHESIONS; METAL SURFACES; ORDER OF MAGNITUDE; ORDERS OF MAGNITUDE; PHONON TRANSPORT; PHOTONIC PACKAGING; RELIABILITY IMPROVEMENT; SCANNING ELECTRONIC MICROSCOPY; SI SUBSTRATES; SILICON CHIP; SUBSTRATE INTERFACE; SUPPORT LAYER; THERMAL CVD; THERMAL INTERFACE MATERIALS; THERMAL INTERFACES; THERMAL MANAGEMENT; THERMAL TRANSPORT; VERTICAL ALIGNMENT; VERTICALLY ALIGNED; VERTICALLY ALIGNED CARBON NANOTUBE; WELL-ALIGNED;

EID: 70349678289     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074051     Document Type: Conference Paper
Times cited : (16)

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