-
1
-
-
3943082835
-
Experimental verification of drop/impact simulation for a cellular phone
-
J.G. Kim and Y.K. Park, "Experimental verification of Drop/Impact simulation for a cellular phone, " Experimental Mechanics, Vol. 44, No. 4, pp.375-380, 2004.
-
(2004)
Experimental Mechanics
, vol.44
, Issue.4
, pp. 375-380
-
-
Kim, J.G.1
Park, Y.K.2
-
2
-
-
28444453001
-
Novel board level drop test simulation using implicit transient analysis with input-g method
-
Singapore
-
th EPTC, 2004, Singapore, pp. 671.
-
(2004)
th EPTC
, pp. 671-677
-
-
Luan, J.E.1
Tee, T.Y.2
-
3
-
-
2942740958
-
Impact life prediction modeling of TFBGA packages under board level drop test
-
Tong Yan, Tee, Hun Shen, Ng, Chwee Teck, Lim, Eric Pek and Zhaowei Zhong, "Impact Life prediction modeling of TFBGA packages under board level drop test, " Microelectronics and Reliability, Vol. 44, pp.1131-1142, 2004.
-
(2004)
Microelectronics and Reliability
, vol.44
, pp. 1131-1142
-
-
Pek, E.1
Zhong, Z.2
Tee, T.Y.3
Ng, H.S.4
Lim, C.T.5
-
4
-
-
24644500322
-
Board level drop test reliability of IC packages
-
Lake Buena Vista, FL
-
th ECTC, Lake Buena Vista, FL, pp.630-636, 2005.
-
(2005)
th ECTC
, pp. 630-636
-
-
Chai, T.C.1
Sharon, Q.2
Hnin, W.Y.3
Wong, E.H.4
-
5
-
-
33645132650
-
New insights into board level drop impact
-
May-June, 6
-
E.H. Wong and Y.-W. Mai, "New insights into board level drop impact, " Microelectronics and Reliability, Volume 46, Issues 5-6, Pages 930-938, May-June 2006.
-
(2006)
Microelectronics and Reliability
, vol.46
, Issue.S5
, pp. 930-938
-
-
Wong, E.H.1
Mai, Y.-W.2
-
6
-
-
35648968617
-
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
-
December
-
Xin Qu, Zhaoyi Chen, Bo Qi, Taekoo Lee and Jiaji Wang, "Board level drop test and simulation of leaded and lead-free BGA-PCB assembly, " Microelectronics Reliability, Volume 47, Issue 12, pp.2197-2204, December 2007.
-
(2007)
Microelectronics Reliability
, vol.47
, Issue.12
, pp. 2197-2204
-
-
Qu, X.1
Chen, Z.2
Qi, B.3
Lee, T.4
Wang, J.5
-
8
-
-
50949125948
-
Influence of fastening methods on the dynamic response and reliability assessment of PCBS in cellular phones under free drop
-
and, May 28-31
-
Seungbae Park, Abdullah, Al-Yafawi, Da Yu, Jae Kwak, John Lee and Nam, Seo Goo, "Influence of Fastening Methods on the Dynamic Response and Reliability Assessment of PCBs in Cellular Phones under Free Drop, " ITherm 2008, May 28-31, 2008.
-
(2008)
ITherm 2008
-
-
Park, S.1
Yu, D.2
Kwak, J.3
Lee, J.4
Al-Yafawi, A.5
Seo Goo, N.6
-
9
-
-
70349668036
-
Measurement of transient dynamic response of circuit boards of a handheld device during drop using 3D digital image correlation
-
and
-
Seungbae Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, and James M., Pitarresi, "Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device during Drop Using 3D Digital Image Correlation, " Journal of Electronic Packaging, 2007.
-
(2007)
Journal of Electronic Packaging
-
-
Park, S.1
Shah, C.2
Kwak, J.B.3
Jang, C.4
Chung, S.5
Pitarresi, J.M.6
-
10
-
-
35348841459
-
Transient dynamic simulation and full-field test validation for a slim-pcb of mobile phone under drop/impact
-
May 29 2007-June 1
-
th Electronic Components and Technology, pp. 914-923, May 29 2007-June 1 2007.
-
(2007)
th Electronic Components and Technology
, pp. 914-923
-
-
Park, S.1
Shah, C.2
Kwak, J.3
Jang, C.4
Pitarresi, J.5
Park, T.6
Jang, S.7
-
11
-
-
2942740958
-
Impact life prediction modeling of TFBGA packages under board level drop test
-
Tong Yan, Tee, Hun Shen, Ng, Chwee Teck, Lim, Eric Pek and Zhaowei Zhong, "Impact life prediction modeling of TFBGA packages under board level drop test, " Microelectronics Reliability, Volume 44, pp.1131-1142, 2004.
-
(2004)
Microelectronics Reliability
, vol.44
, pp. 1131-1142
-
-
Pek, E.1
Zhong, Z.2
Tee, T.Y.3
Ng, H.S.4
Lim, C.T.5
-
14
-
-
84886891252
-
-
ANSYS, Inc., Theory Manual
-
ANSYS, Inc. ANSYS ® v11.0, Theory Manual.
-
ANSYS ® V11.0
-
-
|