Patterned eutectic bonding with Al/Ge thin films for MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2639, Issue , 1995, Pages 46-52

  Zavracky, Paul M ^a   Vu, Bao ^a  

^a NORTHEASTERN UNIVERSITY   (United States)

Author keywords

Bonding; Eutectics; MEMS

Indexed keywords

ALUMINUM ALLOYS; COMPOSITION; DEBONDING; EUTECTICS; MICROMACHINING; THIN FILMS;

EUTECTIC BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0029418990     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221299     Document Type: Conference Paper

References (6)

1. Aligned au-si eutectic bonding of silicon structures
2. Au-in bonding below the eutectic temperature
3. Bulk-micromachined through-wafer interconnect for silicon wager-to wafer bonding
4. In situ investigation of precise high strength micro assembly using au-si eutectic bonding
5. A practical microgripper by fine alignment, eutectic bonding and SMA actuation