Low temperature, wafer level Au-In bonding for ISM packaging

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Qian, Wang ^a   Kyudong, Jung ^a   Minseog, Choi ^a   Woonbae, Kim ^a   Sukjin, Harn ^a   Byunggil, Jeong ^a   Changyoul, Moon ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Au In; ISM; Packaging; WLP

Indexed keywords

FABRICATION; IMAGE SENSORS; METALLIZING; MULTILAYERS; SOLDERING ALLOYS; WAFER BONDING;

BONDING QUALITY EVALUATION; IMAGE SENSOR MODULE (ISM) PACKAGING; METALLIZATION SYSTEMS; WAFER LEVEL PACKAGING (WLP) TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 34948890436     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359741     Document Type: Conference Paper

References (0)