Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 228-230

  Tokei, Zs ^a   Roussel, Ph ^a   Stucchi, M ^a   Versluijs, J ^a   Ciofi, I ^a   Carbonell, L ^a   Beyer, G P ^a   Cockburn, A ^b   Agustin, M ^c   Shah, K ^c  

^a IMEC   (Belgium)

^b Applied Materials Belgium   (Belgium)

^c APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER DAMASCENE; DIELECTRIC RELIABILITY; EXPERIMENTAL VALIDATIONS; LOW-K MATERIALS; QUANTITATIVE MODELS; TDDB LIFETIME;

EID: 70349446737     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090395     Document Type: Conference Paper

References (7)

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2. F.Chen, O. Bravo, K. Chanda, P. McLaughlin, T. Sullivan, J. Gill, J. Lloyd, R. Kontra, J. Aitken, "A comprehensive study of low-k SiOCH TDDB phenomena and its reliability lifetime model development" IEEE IRPS, San Jose, CA, 2006, pp. 46-53
3. M. Stucchi, Zs. Tokei, "Impact of LER and via misalignment on the electric field between nanometer-scale wires", IEEE IITC, San Francisco, CA, 2008, pp: 174-176
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5. J. Van Olmen, A. Al-Bayati, G.P. Beyer, P. Boelen, L. Carbonell, C. Zhao, I. Ciofi, M. Claes, A. Cockburn, G. Druais, D. Hendrickx, N. Heylen, E. Kesters, S. Lytle, A. Noori, M. Op de Beeck, H. Struyf, Zs. Tokei, J. Versluijs, "Integration of 50nm half pitch single damascene copper trenches in BDII by means of double patterning 193nm immersion lithography on metal hardmask", AMC 2007, Albany, NY, pp. 355-361
6. Zs. Tokei, Y-L. Li, I. Ciofi, K. Croes, G.P. Beyer, "Low-k dielectric reliability: impact of test structure choice, copper and integrated dielectric quality", IEEE IITC, San Francisco, CA, 2008, pp. 111-113
7. Zs. Tokei, Ph. Roussel, M. Stucchi, "A model for describing the impact of LER on BEOL TDDB lifetime", to be published