Integration of 50nm half pitch single damascene copper trenches in black diamond® II by means of double patterning 193nm immersion lithography on metal hardmask

Advanced Metallization Conference (AMC)

Volumn , Issue , 2008, Pages 355-361

  Van Olmen, J ^a   Al Bayati, A ^b   Beyer, G ^a   Boelen, P ^c   Carbonell, L ^a   Chan, Kelvin ^b   Ciofi, I ^a   Claes, M ^a   Cockburn, A ^c   Druais, G ^d   Hendrickx, D ^a   Heylen, N ^a   Kesters, E ^a   Lytle, S ^e   Noori, A ^b   Shah, Kavita ^b   Op De Beeck, M ^a   Struyf, H ^a   Tokei, Zs ^a   Versluijs, J ^a   Zhao, Chao ^a   more..

^a IMEC   (Belgium)

^b APPLIED MATERIALS INC   (United States)

^c Applied Materials Belgium   (Belgium)

^d STMICROELECTRONICS   (Belgium)

^e TEXAS INSTRUMENTS   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

193NM IMMERSION LITHOGRAPHIES; 300MM WAFERS; DOUBLE PATTERNING; HARD MASKS; LOW-K DIELECTRICS; SINGLE DAMASCENES; SUCCESSFUL INTEGRATIONS;

BORON CARBIDE; COPPER; DIAMONDS; LITHOGRAPHY;

METALLIZING;

EID: 55349089562     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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