PECVD silicon carbide as a thin film packaging material for microfabricated neural electrodes

Materials Research Society Symposium Proceedings

Volumn 1009, Issue , 2007, Pages 8-13

  Hess, Allison ^a   Parro, Rocco ^a   Du, Jiangang ^a   Dunning, Jeremy ^b   Scardelletti, Maximillian ^c   Zorman, Christian A ^a  

^a Case Western Reserve University   (United States)

^b LOUIS STOKES CLEVELAND VA MEDICAL CENTER   (United States)

^c NASA GLENN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; CHIP SCALE PACKAGES; ELECTRODES; INTERFACES (MATERIALS); LEAKAGE CURRENTS; MICROFABRICATION; NEURAL PROSTHESES; PACKAGING MATERIALS; PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYIMIDES; SILICON CARBIDE; SILICON WAFERS; SUBSTRATES;

AMORPHOUS SILICON CARBIDE (A-SIC); FLEXIBLE POLYIMIDE SUBSTRATE; INTER-DIGITATED ELECTRODES; MICROMACHINING TECHNIQUES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITIONS (PE CVD); POLYIMIDE SUBSTRATE; THIN FILM PACKAGING; THIN-FILM COATINGS;

THIN FILMS;

EID: 70349228097     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-1009-u04-03     Document Type: Conference Paper

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