Coffin-Manson equation determination for Sn-Zn based lead-free solder joints

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Sun, Peng ^a,c   Andersson, Cristina ^c   Cheng, Zhaonian ^c   Lai, Zonghe ^c   Shangguan, Dongkai ^b   Liu, Johan ^a,c  

^a SHANGHAI UNIVERSITY   (China)

^b Flextronics   (United States)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EUTECTICS; FINITE ELEMENT METHOD; LEAD; SHEAR STRAIN; TIN ALLOYS;

COFFIN MANSON EQUATIONS; LOW CYCLE FATIGUE TESTS;

SOLDERED JOINTS;

EID: 37649027866     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251421     Document Type: Conference Paper

References (12)

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