Electrical properties of electroplated Cu thin film by electrolyte composite

Korean Journal of Materials Research

Volumn 19, Issue 6, 2009, Pages 344-348

  Song, Yoojin ^a,b   Seo, Jung Hye ^b   Lee, Youn Seoung ^b   Rha, Sa Kyun ^b  

^a Korea Research Institute of Standards and Science   (South Korea)

^b Hanbat National University   (South Korea)

Author keywords

Cu; Electrolyte; Electroplating; Resistivity

Indexed keywords

AFM; AG/AGCL; ATOMIC FORCE MICROSCOPES; CONCENTRATION OF; COUNTER ELECTRODES; CU; CU FILMS; CU THIN FILM; ELECTRICAL PROPERTY; ELECTRICAL RESISTIVITY; ELECTROLYTE EFFECT; ELECTROPLATED CU FILMS; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; FILM DENSITY; FOUR-POINT PROBE; MATERIAL PROPERTY; P-TYPE SI; POTENTIOSTATIC ELECTRODEPOSITION; REFERENCE ELECTRODES; RESISTIVITY; SEED LAYER; SEM; TERMINAL METHOD; WORKING ELECTRODE; XPS; XRD;

ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; ELECTRIC CONDUCTIVITY; ELECTROCHEMICAL ELECTRODES; ELECTROLYSIS; ELECTROLYTES; ELECTROPLATING; ELECTROPLATING SOLUTIONS; EMISSION SPECTROSCOPY; FIELD EMISSION; METALLIC FILMS; MICROSCOPES; PHOTORESISTS; PLATINUM; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 70349190518     PISSN: 12250562     EISSN: None     Source Type: Journal    
DOI: 10.3740/MRSK.2009.19.6.344     Document Type: Article

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