Environmental testing of fine interconnections ink jet-printed on flexible organic substrates

Journal of Imaging Science and Technology

Volumn 53, Issue 4, 2009, Pages 0412041-0412045

  Caglar, Umur ^a   Kaija, Kimmo ^a   Mansikkamäki, Pauliina ^b  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION FACTORS; EFFECTS OF TEMPERATURE; ELECTRICAL RESISTANCES; ENVIRONMENTAL RELIABILITY; ENVIRONMENTAL TEST; HUMIDITY TESTS; INDUSTRIAL TESTS; INK JET; INTEGRATED CIRCUIT INTERCONNECTIONS; ORGANIC SUBSTRATE; RELATIVE HUMIDITIES; ROOM TEMPERATURE; TEMPERATURE CYCLING; VARYING TEMPERATURE;

ELECTRIC RESISTANCE; ENVIRONMENTAL TESTING; INK; INTEGRATED CIRCUITS; JETS; MOISTURE; RELIABILITY; SILVER;

ATMOSPHERIC HUMIDITY;

EID: 69749119190     PISSN: 10623701     EISSN: None     Source Type: Journal    
DOI: 10.2352/J.lmagingSci.Technol.2009.53.4.041204     Document Type: Conference Paper

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