Temperature-dependent reliability of inkjet-printed structures in constant-humidit environment

International Conference on Digital Printing Technologies

Volumn , Issue , 2008, Pages 387-390

  Caglar, Umur ^a   Mansikkamäki, Pauliina ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BEFORE AND AFTER; DEGREE OF RELIABILITY; ELECTRONIC COMPONENT; ENVIRONMENTAL RELIABILITY; HUMIDITY TESTS; IC INTERCONNECTIONS; INK JET TECHNOLOGY; MATERIAL WASTES; NANO SILVER; PRINTED STRUCTURES; PRINTING RESOLUTION; PROCESSING TIME; SEMICONDUCTOR INDUSTRY; TEMPERATURE CYCLING TESTS; TEMPERATURE DEPENDENT; TEST RUNS; TEST STANDARDS; VARIABLE ENVIRONMENT; VARYING TEMPERATURE;

MOISTURE; PRINTING; PROCESSING; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SILVER;

TESTING;

EID: 67249147402     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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