Interfaces friction effect of sliding contact on nanoindentation test

Sensors and Actuators, A: Physical

Volumn 117, Issue 2, 2005, Pages 309-316

  Tsou, Chingfu ^a   Hsu, Changchun ^b   Fang, Weileun ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Friction force; Mechanical properties; Nanoindenation; Thin film

Indexed keywords

FRICTION FORCE; NANOINDENTATION; SLIDING CONTACTS;

BRITTLENESS; FRICTION; INDENTATION; INTERFACES (MATERIALS); MECHANICAL TESTING; THIN FILMS;

MICROELECTROMECHANICAL DEVICES;

EID: 69749110618     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.06.030     Document Type: Article

References (16)

1. H.D. Espinosa, M. Fischer, E. Herbert, W.C. Oliver, Identification of residual stress state in an RF-MEMS device, www.mts.com/nano/MEMS.development. htm.
2. M. Qin, M.C. Poon, C.Y. Yuen, A study of nickel suicide film as a mechanical material, Sens. Actuators A 87 (2000) 90-95.
3. W.C. Oliver, C.J. McHargue, Characterizing the hardness and modulus of thin films using mechanical properties microprobe, Thin Solid Film 161 (1988) 117-122.
4. T.P. Weihs, S. Hong, J.C. Bravman, W.D. Nix, Measuring the strength and stiffness of thin film materials by mechanically deflecting cantilever microbeams, Mater. Res. Soc. Symp. Proc. 130 (1989) 87-92.
5. S. Johansson, J.A. Schweitz, Fracture testing of silicon microelements in situ in a scanning electron microscope, J. Appl. Phys. 63 (1988) 4799-4803.
6. R.P. Vinci, Bravman, Mechanical testing of thin films, in: Proceedings of the IEEE Transducers'91, Solid-State Sensor and Actuators, Yokohama, Japan, 1991, pp. 943-948.
7. T.Y. Zhang, Y.J. Su, C.F. Qian, M.H. Zhao, L.Q. Chen, Microbridge testing of silicon nitride thin film deposited on silicon wafers, Acta Mater. 48 (2000) 2843-2857.
8. C.J. Wilson, A. Ormeggi, M. Narbutovskih, Fracture testing of silicon microcantilever beams, J. Appl. Phys. 79 (1996) 2386-2393.
9. K.J. Wahl, S.V. Stepnowski, W.N. Unertl, Viscoelastic effects in nanometer-scal contacts under shear, Tribol. Lett. 5 (1998) 103-107.
10. S.A. Syed Asyf, K.J. Wahl, R.J. Colton, The influence of oxide and adsorbates on the nanomechanical response of silicon surfaces, J. Mater. Res. 15 (2000) 546-553.
11. M.M. Chaudhri, A note on a common mistake in the analysis of nanoindentation data, J. Mater. Res. 16 (2001) 336-339.
12. M.T. Kim, Influence of substrates on the elasticreaction of films for the microdentation tests, Thin Solid Films 283 (1996) 12-16.
13. W.C. Oliver, G.M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J. Mater. Res. 7 (1992) 1564-1583.
14. S.A. Syed Asyf, K.J. Wahl, R.J. Colton, Nanoindenation and contact stiffness measurement using force modulation with a capacitive load-displacement transducer, Rev. Sci. Inst. 70 (1999) 2408-2413.
15. B. Borovsky, J. Krim, Measuring nanomechanical properties of a dynamic contact using an indenter and quartz crystal microbalance, J. Appl. Phys. 90 (2001) 6391-6396.
16. G.M. Pharr, W.C. Oliver, Measurement of thin film mechanical properties using nanoindentation, MRS Bull. 17 (1992) 28-33.