Study of nickel silicide film as a mechanical material

Sensors and Actuators, A: Physical

Volumn 87, Issue 1-2, 2000, Pages 90-95

  Qin, Ming ^a   Poon, M C ^a   Yuen, C Y ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; EVAPORATION; FILM PREPARATION; MECHANICAL VARIABLES MEASUREMENT; MICROELECTROMECHANICAL DEVICES; RAPID THERMAL ANNEALING; SINTERING; STRUCTURE (COMPOSITION); THERMAL EFFECTS; THIN FILMS; VACUUM APPLICATIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

HIGH VACUUM EVAPORATION; MECHANICAL MATERIAL; NICKEL SILICIDE;

NICKEL COMPOUNDS;

EID: 0034500739     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00463-5     Document Type: Article

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