The hexagonal close-packed nickel nanocrystals prepared by fast scan voltammetry

Journal of Colloid and Interface Science

Volumn 339, Issue 1, 2009, Pages 125-132

  Mohamed Ali Tehrani, Ramin ^a   Ab Ghani, Sulaiman ^a  

^a SCHOOL OF PHYSICS   (Malaysia)

Author keywords

Electrodeposition; Fast scan voltammetry; Hexagonal close packed; Nanocrystals; Nickel

Indexed keywords

AG/AGCL; AVERAGE DIAMETER; COMPOSITE GRAPHITE ELECTRODES; DEPOSITION PROCESS; FAST SCAN; FAST SCAN VOLTAMMETRY; HEXAGONAL CLOSE-PACKED; HYDROGEN EVOLUTION; INITIAL POTENTIAL; NICKEL NANOCRYSTALS; OVER POTENTIAL; PLATING SOLUTIONS; SCAN RATES; STRUCTURAL FORMATION;

ELECTRODEPOSITION; GRAPHITE; GRAPHITE ELECTRODES; HYDROGEN; NANOCRYSTALS; NICKEL ALLOYS; VOLTAMMETRY;

NICKEL;

AMMONIUM CHLORIDE; GRAPHITE; HYDROGEN; NANOCRYSTAL; NICKEL; NICKEL CHLORIDE; SILVER CHLORIDE;

ARTICLE; COMPOSITE MATERIAL; CONTROLLED STUDY; CRYSTAL STRUCTURE; CRYSTALLIZATION; ELECTROCHEMISTRY; ELECTRODE; MORPHOLOGY; PARTICLE SIZE; PHYSICAL CHEMISTRY; PLATING MEDIUM; POTENTIOMETRY; PRIORITY JOURNAL;

EID: 69349087317     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2009.07.042     Document Type: Article

References (73)

1. Sun X.C., and Dong X.L. Mater. Res. Bull. 37 (2002) 991
2. Guo G.Y., and Wang H.H. Chin. J. Phys. 38 (2000) 949
3. Hinotsu T., Jeyadevan B., and Chinnasamy C.N. J. Appl. Phys. 95 (2004) 7477
4. Tzitzios V., Basina G., Gjoka M., et al. Nanotechnology 17 (2006) 3750
5. Zheng W.T., and Sun C.Q. Prog. Solid State Chem. 34 (2006) 1
6. Host J.J., Block J.A., and Parvin K. J. Appl. Phys. 83 (1998) 793
7. Pradhan A.K. Appl. Surf. Sci. 220 (2003) 26
8. Kumar D., Yarmolenko S., and Sankar J. Composites B 35 (2004) 149
9. Gong J., Wang L.L., Liu Y., Yang J.H., and Zong Z.G. J. Alloy Compd. 457 (2008) 6
10. He X., Kong L.T., and Liu B.X. J. Appl. Phys. 97 (2005) 1
11. Jeon Y.T., Moon J.Y., Lee G.H., Park J., and Chang Y. J. Phys. Chem. B 110 (2006) 1187
12. Tian W., Sun H.P., and Pana X.Q. Appl. Phys. Lett. 86 (2005) 131915
13. Amoruso S., Ausanio G., de Lisio C., Iannotti V., Vitiello M., Wang X., and Lanotte L. Appl. Surf. Sci. 247 (2005) 71
14. Wojcieszak R., Zielinski M., Monteverdi S., and Bettahar M.M. J. Colloid Interface Sci. 299 (2006) 238
15. Cheng J., Zhang X., and Ye Y. J. Solid State Chem. 179 (2006) 91
16. Migowski P., Teixeira S.R., Machado G., Alves M.C.M., Geshev J., and Dupont J. J. Electron Spectrosc. 156 (2007) 195
17. Yen M.Y., Chiu C.W., Chen F.R., Kai J.J., Lee C.Y., and Chiu H.T. Langmuir 20 (2004) 279
18. Hou Y.L., and Gao S. J. Alloy Compd. 365 (2004) 112
19. Syukri B.T., Ohya Y., and Takahashi Y. Mater. Chem. Phys. 78 (2003) 645
20. Wang W.N., Itoh Y., Lenggoro I.W., and Okuyama K. Mater. Sci. Eng. B 111 (2004) 69
21. Lo C.H., Tsung T.T., and Chen L.C. JSME Int. J. B 48 (2006) 750
22. He Y., Li X., and Swihart M.T. Chem. Mater. 17 (2005) 1017
23. Reetz M.T., and Helbig W. J. Am. Chem. Soc. 116 (1994) 7401
24. Chu S.Z., Wada K., Inoue S., Todoroki S.I., Takahashi Y.K., and Hono K. Chem. Mater. 14 (2002) 4595
25. Zhou H., Peng C., Jiao S., Zeng W., Chen J., and Kuang Y. Electrochem. Commun. 8 (2006) 1142
26. Wright J.G., and Goddard J. Philos. Mag. 11 (1965) 485
27. Shervedani R.K., and Madram A.R. Electrochim. Acta 53 (2007) 426
28. Jafarian M., Azizi O., Gobal F., and Mahjani M.G. Int. J. Hydrogen Eng. 32 (2007) 1686
29. Ganesh V., Vijayaraghavan D., and Lakshminarayanan V. Appl. Surf. Sci. 240 (2005) 286
30. Zach M.P., and Penner R.M. Adv. Mater. 12 (2000) 878
31. Atashbar M.Z., Bliznyuk V.N., and Singamaneni S. Mater. Res. Soc. Symp. Proc. 853 (2004) 49
32. Mohamed Ali Tehrani R., and Ab Ghani S. J. Electrochem. Soc. 155 (2008) K199
33. Ueda M., Dietz H., Anders A., Kneppe H., Meixner A., and Plieth W. Electrochim. Acta 48 (2002) 377
34. Davila-Marti{dotless}nez R.E., Cueto L.F., and Sanchez E.M. Surface Sci. 600 (2006) 3427
35. Cueto L.F., Hirata G.A., and Sanchez E. J. Sol-Gel Sci. Technol. 37 (2006) 105
36. Yae S., Kitagaki M., Hagihara T., Miyoshi Y., Matsuda H., Parkinson B.A., and Nakato Y. Electrochim. Acta 47 (2001) 345
37. Sandmann G., Dietz H., and Plieth W. J. Electroanal. Chem. 491 (2000) 78
38. Ibach H. Physics of Surfaces and Interfaces (2006), Springer, Berlin
39. Turco Liveri V. Controlled Synthesis of Nanoparticles in Microheterogeneous Systems (Nanostructure Science and Technology) (2006), Springer, Berlin
40. Riley D.J. J. Curr. Opin. Colloid Interface 7 (2002) 186
41. Petrovic Z., Metikos-Hukovic M., Grubac Z., and Omanovic S. Thin Solid Films 513 (2006) 193
42. Shevchenko E.V., Talapin D.V., Schnablegger H., Kornowski A., Festin O., Svedlindh P., Haase M., and Weller H. J. Am. Chem. Soc. 125 (2003) 9090
43. Hashimoto K., Sasaki T., Meguro S., and Asami K. Mat. Sci. Eng. A-Struct. 375 (2004) 942
44. Chen L., and Lasia A. J. Electrochem. Soc. 139 (1992) 3458
45. Cao H., Wang L., Qiu Y., Wu Q., Wang G., Zhang L., and Liu X. ChemPhysChem 7 (2006) 1500
46. Gou S.P., and Sun I.W. Electrochim. Acta 53 (2008) 2538
47. Song K.D., Kim K.B., Han S.H., and Lee H.K. Electrochem. Commun. 5 (2003) 460
48. Assuncao N.A., de Giz M.J., Tremiliosi-Filho G., and Gonzalez E.R. J. Electrochem. Soc. 144 (1997) 2794
49. Hitz C., and Lasia A. J. Electroanal. Chem. 532 (2002) 133
50. Nikolic N.D., Popov K.I., Pavlovic L.J., and Pavlovic M.G. J. Electroanal. Chem. 588 (2006) 88
51. E. Tamburri, F. Toschi, V. Guglielmotti, E. Scatena, S. Orlanducci, M. L. Terranova, J. Nanopart. Res. doi: 10.1007/s11051-008-9520-y.
52. Penner R.M. J. Phys. Chem. B 106 (2002) 3339
53. Ispas A., Matsushima H., Bund A., and Bozzini B. J. Electroanal. Chem. 626 (2009) 174
54. A.V. Korzhak, A.E. Raevskaya, A.L. Stroyuk, N.I. Yermokhina, V.I. Litvin, V.K. Bukhtiyarov, P.A. Manorik, V.G. Ilyin, S.YA. Kuchmii, NATO Security Through Science Series, Springer Netherlands, 2007, pp. 587-597.
55. Lantelme F., and Seghiouer A. J. Appl. Electrochem. 28 (1998) 907
56. Wang Y., Deng J., Di J., and Tu Y. Electrochem. Commun. 11 (2009) 1034
57. Fransaer J.L., and Penner R.M. J. Phys. Chem. B 103 (1999) 7643
58. Mann O., Pan G.-B., and Freyland W. Electrochim. Acta 54 (2009) 2487
59. Atashbar M.Z., Banerji D., Singamaneni S., and Bliznyuk V. Nanotechnology 15 (2004) 374
60. Hemenger P.M., and Weik H. J. Appl. Phys. 36 (1965) 1052
61. Cullity B.D. Elements of X-Ray Diffraction. second ed. (1978), Adison-Wesley Publishing Company, Inc., London, UK
62. Yousuf M., Sahu P.C., Jajoo H.K., Rajagopalan S., and Rajan K.G. J. Phys. F: Metal Phys. 16 (1986) 373
63. Mi Y., Yuan D., Liu Y., Zhang J., and Xiao Y. Mater. Chem. Phys. 89 (2005) 359
64. Wang H., Jiao X., and Chen D. J. Phys. Chem. C 112 (2008) 18793
65. Vergara J., and Madurga V. J. Mater. Res. 17 (2002) 2099
66. Han M., Liu Q., He J., Song Y., Xu Z., and Zhu J. Adv. Mater. 19 (2007) 1096
67. Luo X., Chen Y., Yue G.-H., Peng D.-L., and Luo X. J. Alloy Compd. 476 (2009) 864
68. Chen Y., Peng D.-L., Lin D., and Luo X. Nanotechnology 18 (2007) 505703
69. Vasilakopoulos D., Bouroushian1 M., and Spyrellis N. Electrochim. Acta 54 (2009) 2509
70. Khelladi M.R., Mentar L., Azizi A., Sahari A., and Kahoul A. Mater. Chem. Phys. 115 (2009) 385
71. Boyanov S., Annou K., Villevieille C., Pelosi M., Zitoun D., and Monconduit L. Ionics 14 (2008) 183
72. Rodriguez-Gonzalez V., Marceau E., Beaunier P., Che M., and Train C. J. Solid State Chem. 180 (2007) 22
73. Wei Z., Yan P., Feng W., Dai J., Wang Q., and Xia T. Mater. Charact. 57 (2006) 176