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Volumn 483, Issue 1-2, 2009, Pages 402-405
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A comparative study of the electrochemical deposition of molybdenum oxides thin films on copper and platinum
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Author keywords
Atomic Force Microscopy AFM; Electrochemical reactions; Thin films
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Indexed keywords
AFM IMAGE;
AG/AGCL;
AMMONIUM MOLYBDATE;
AS-DEPOSITED THIN FILMS;
COMPARATIVE STUDIES;
CONSTANT POTENTIAL;
ELECTROCHEMICAL DEPOSITION;
ELECTROCHEMICAL REACTIONS;
GRANULAR MORPHOLOGY;
MOLYBDENUM OXIDES;
PHASE PRESENT;
SMOOTH COPPER;
XRD;
XRD SPECTRA;
AMMONIUM COMPOUNDS;
ARGON;
ATOMIC FORCE MICROSCOPY;
ATOMS;
COPPER;
COPPER OXIDES;
DEPOSITION;
ELECTROCHEMICAL CORROSION;
ELECTRODEPOSITION;
HEAT TREATMENT;
MOLYBDENUM;
MOLYBDENUM COMPOUNDS;
NEGATIVE IONS;
PLATINUM;
REDUCTION;
THERMAL EFFECTS;
THIN FILMS;
VAPOR DEPOSITION;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
FILM PREPARATION;
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EID: 69249244321
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.08.119 Document Type: Article |
Times cited : (14)
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References (17)
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