-
1
-
-
0033678287
-
Chip multilayer antenna for 2.45 GHz-band application using LTCC technology
-
Y. Dakeya, T. Suesada, K. Asakura, N. Nakajima, and H. Mandai "Chip multilayer antenna for 2.45 GHz-band application using LTCC technology," in IEEE Int. MTT-S Int. Microwave Symp. Digest, 2000, vol. 3, pp. 1693-1696.
-
(2000)
IEEE Int. MTT-S Int. Microwave Symp. Digest
, vol.3
, pp. 1693-1696
-
-
Dakeya, Y.1
Suesada, T.2
Asakura, K.3
Nakajima, N.4
Mandai, H.5
-
2
-
-
28644435278
-
WLAN chip antenna mountable above the system ground plane of a mobile device
-
Nov
-
K. L. Wong and C. H. Chang, "WLAN chip antenna mountable above the system ground plane of a mobile device," IEEE Trans. Antennas Propag., vol. 53, no. 11, pp. 3496-3499, Nov. 2005.
-
(2005)
IEEE Trans. Antennas Propag
, vol.53
, Issue.11
, pp. 3496-3499
-
-
Wong, K.L.1
Chang, C.H.2
-
3
-
-
4544353205
-
A new dual-band antenna for WLAN applications
-
Jun
-
Y. Y. Wang and S. J. Chang, "A new dual-band antenna for WLAN applications," in IEEE Antennas Propag. Soc. Int. Symp., Jun. 2004, vol. 3, pp. 2611-2614.
-
(2004)
IEEE Antennas Propag. Soc. Int. Symp
, vol.3
, pp. 2611-2614
-
-
Wang, Y.Y.1
Chang, S.J.2
-
4
-
-
9244227613
-
Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications
-
Nov
-
R. L. Li et al., "Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications," IEEE Trans. Adv. Packag., vol. 27, no. 4, pp. 581-589, Nov. 2004.
-
(2004)
IEEE Trans. Adv. Packag
, vol.27
, Issue.4
, pp. 581-589
-
-
Li, R.L.1
-
5
-
-
0029368873
-
Planar inverted F antenna loaded with high permittivity material
-
Y. Hwang, Y. P. Zhang, G. X. Zheng, and T. K. C. Lo, "Planar inverted F antenna loaded with high permittivity material," Electron. Lett., vol. 31, no. 20, pp. 1710-1712, 1995.
-
(1995)
Electron. Lett
, vol.31
, Issue.20
, pp. 1710-1712
-
-
Hwang, Y.1
Zhang, Y.P.2
Zheng, G.X.3
Lo, T.K.C.4
-
6
-
-
0037168135
-
Integration of microstrip antenna on cavity-down ceramic ball grid array package
-
Y. P. Zhang, "Integration of microstrip antenna on cavity-down ceramic ball grid array package," Electron. Lett., vol. 38, no. 22, pp. 1307-1308, 2002.
-
(2002)
Electron. Lett
, vol.38
, Issue.22
, pp. 1307-1308
-
-
Zhang, Y.P.1
-
7
-
-
7244230018
-
Integrated ceramic ball grid array package antenna
-
Oct
-
Y. P. Zhang, "Integrated ceramic ball grid array package antenna," IEEE Trans. Antennas Propag., vol. 52, no. 10, pp. 2538-2544, Oct. 2004.
-
(2004)
IEEE Trans. Antennas Propag
, vol.52
, Issue.10
, pp. 2538-2544
-
-
Zhang, Y.P.1
-
8
-
-
0043094069
-
Single-package 5 GHz WLAN RE module with embedded patch antenna and 20 dBm power amplifier
-
Jun
-
J. Ryckaert et al., "Single-package 5 GHz WLAN RE module with embedded patch antenna and 20 dBm power amplifier," in IEEE Int. MTT-S Int. Symp. Digest, Jun. 2003, vol. 2, pp. 1037-1040.
-
(2003)
IEEE Int. MTT-S Int. Symp. Digest
, vol.2
, pp. 1037-1040
-
-
Ryckaert, J.1
-
9
-
-
33747604617
-
Package-level integrated antennas based on LTCC technology
-
Aug
-
S. H. Wi et al., "Package-level integrated antennas based on LTCC technology," IEEE Trans. Antennas Propag., vol. 54, no. 8, pp. 2190-2197, Aug. 2006.
-
(2006)
IEEE Trans. Antennas Propag
, vol.54
, Issue.8
, pp. 2190-2197
-
-
Wi, S.H.1
-
10
-
-
33947411453
-
Package-level integrated LTCC antenna for RE package application
-
Feb
-
S. H. Wi et al., "Package-level integrated LTCC antenna for RE package application," IEEE Trans. Adv. Packag., vol. 30, no. l, pp. 132-141, Feb. 2007.
-
(2007)
IEEE Trans. Adv. Packag
, vol.30
, Issue.L
, pp. 132-141
-
-
Wi, S.H.1
-
11
-
-
34748831668
-
Integrated hybrid dielectric resonator antenna for system-in-package application
-
Jun
-
Y. Gao, A. P. Popov, B. L. Ooi, and M. S. Leong, "Integrated hybrid dielectric resonator antenna for system-in-package application," in IEEE Int. MTT-S Int. Symp. Digest, Jun. 2007, pp. 1653-1656.
-
(2007)
IEEE Int. MTT-S Int. Symp. Digest
, pp. 1653-1656
-
-
Gao, Y.1
Popov, A.P.2
Ooi, B.L.3
Leong, M.S.4
-
12
-
-
32444442879
-
Novel application of the hollow dielectric resonator antenna as a packaging cover
-
Feb
-
E. H. Lim and K. W. Leung, "Novel application of the hollow dielectric resonator antenna as a packaging cover," IEEE Trans. Antennas Propag., vol. 54, no. 2, pp. 484-487, Feb. 2006.
-
(2006)
IEEE Trans. Antennas Propag
, vol.54
, Issue.2
, pp. 484-487
-
-
Lim, E.H.1
Leung, K.W.2
-
13
-
-
33646507847
-
A study of dual-mode bandpass filter integrated inBGApackage for single-chip RE transceivers
-
May
-
Y. P. Zhang, X. J. Li, and A. Phang, "A study of dual-mode bandpass filter integrated inBGApackage for single-chip RE transceivers," IEEE Trans. Adv. Packag., vol. 29, no. 2, pp. 354-358, May 2006.
-
(2006)
IEEE Trans. Adv. Packag
, vol.29
, Issue.2
, pp. 354-358
-
-
Zhang, Y.P.1
Li, X.J.2
Phang, A.3
-
14
-
-
33749871037
-
Dual-band microstrip bandpass filter using stepped impedance resonators with new coupling schemes
-
Oct
-
Y. P. Zhang and M. Sun, "Dual-band microstrip bandpass filter using stepped impedance resonators with new coupling schemes," IEEE Trans. Microw. Theory Tech., vol. 54, no. 10, pp. 3779-3785, Oct. 2006.
-
(2006)
IEEE Trans. Microw. Theory Tech
, vol.54
, Issue.10
, pp. 3779-3785
-
-
Zhang, Y.P.1
Sun, M.2
-
15
-
-
19844372629
-
High-impedance electromagnetic surfaces with a forbidden frequency band
-
Nov
-
D. Sievenpiper, L. J. Zhang, R. F. J. Broas, N. G. Alexopolous, and E. Yablonovitch, "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. Microw. Theory Tech., vol. 47, no. 11, pp. 2059-2074, Nov. 1999.
-
(1999)
IEEE Trans. Microw. Theory Tech
, vol.47
, Issue.11
, pp. 2059-2074
-
-
Sievenpiper, D.1
Zhang, L.J.2
Broas, R.F.J.3
Alexopolous, N.G.4
Yablonovitch, E.5
-
16
-
-
0033871250
-
The use of metal filled via holes for improving isolation in LTCC RE and wireless multichip packages
-
Feb
-
G. E. Ponchak, D. H. Chun, J. G. Yook, and P. B. Ketehi, "The use of metal filled via holes for improving isolation in LTCC RE and wireless multichip packages," IEEE Trans. Adv. Packag., vol. 23, no. 1, pp. 88-99, Feb. 2000.
-
(2000)
IEEE Trans. Adv. Packag
, vol.23
, Issue.1
, pp. 88-99
-
-
Ponchak, G.E.1
Chun, D.H.2
Yook, J.G.3
Ketehi, P.B.4
-
17
-
-
33645719948
-
Theory and analysis of differentiallydriven microstrip antennas
-
Apr
-
Y. P. Zhang and J. J. Wang, "Theory and analysis of differentiallydriven microstrip antennas," IEEE Trans. Antennas Propag., vol. 54, no. 4, pp. 1092-1099, Apr. 2006.
-
(2006)
IEEE Trans. Antennas Propag
, vol.54
, Issue.4
, pp. 1092-1099
-
-
Zhang, Y.P.1
Wang, J.J.2
-
18
-
-
13244256961
-
Radiation-pattern improvement of patch antennas on a large-size substrate using a compact soft-surface structure and its realization on LTCC multilayer technology
-
Jan
-
R. L. Li, G. Dejean, M. M. Tentzeris, J. Papapolymerou, and J. Laskar, "Radiation-pattern improvement of patch antennas on a large-size substrate using a compact soft-surface structure and its realization on LTCC multilayer technology," IEEE Trans. Antennas Propag., vol. 53, no. 1, pp. 200-208, Jan. 2005.
-
(2005)
IEEE Trans. Antennas Propag
, vol.53
, Issue.1
, pp. 200-208
-
-
Li, R.L.1
Dejean, G.2
Tentzeris, M.M.3
Papapolymerou, J.4
Laskar, J.5
-
19
-
-
0030720726
-
A modified transmission line model for cavity backed microstrip antennas
-
Jul
-
S. M. Duffy and M. Gouker, "A modified transmission line model for cavity backed microstrip antennas," in IEEE Antennas Propag. Soc. Int. Symp., Jul. 1997, vol. 4, pp. 2139-2142.
-
(1997)
IEEE Antennas Propag. Soc. Int. Symp
, vol.4
, pp. 2139-2142
-
-
Duffy, S.M.1
Gouker, M.2
|