A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 2, 2006, Pages 354-358

  Zhang, Y P ^a   Li, X J ^a   Phang, T Y ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Ball grid array (BGA) packages; RF bandpass filters; Single chip radio frequency (RF) tranceivers

Indexed keywords

BANDPASS FILTERS; COMPUTER SIMULATION; INSERTION LOSSES; TRANSCEIVERS; WSI CIRCUITS;

BALL GRID ARRAY (BGA) PACKAGE; IN-PACKAGE FILTER; RADIO FREQUENCY TRANSCEIVERS;

ELECTRONICS PACKAGING;

EID: 33646507847     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.873135     Document Type: Article

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