Package-level integrated LTCC antenna for RF package application

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 1, 2007, Pages 132-141

  Wi, Sang Hyuk ^a   Kim, Jin Seok ^b   Kang, Nam Kee ^c   Kim, Jun Chul ^c   Yang, Hoon Gee ^d   Kim, Young Soo ^e   Yook, Jong Gwan ^a  

^a Yonsei University   (South Korea)

^b LG Electronics Inc   (South Korea)

^c Korea Electronic Technology Institute (KETI)   (South Korea)

^d Kwangwoon University   (South Korea)

^e Kyung Hee University   (South Korea)

Author keywords

Antenna integrated package; Compact antenna; Radio frequency (RF) system in package (SIP)

Indexed keywords

BANDWIDTH; DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; GEOMETRY; INTEGRATED CIRCUIT LAYOUT; SLOT ANTENNAS;

ANTENNA-INTEGRATED PACKAGES; COMPACT ANTENNA GEOMETRY; RADIO FREQUENCY (RF) SYSTEM IN PACKAGE (SIP);

ELECTRONICS PACKAGING;

EID: 33947411453     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.890216     Document Type: Article

References (20)

1. S. Pinel, K. Lim, R. G. Dejean, L. Li, C.-H. Lee, M. Maeng, M. F. Davis, M. Tentzeris, and J. Laskar, "System-on-package (SOP) architectures for compact and the low cost RF front-end modules," in Proc. 33rd Eur. Microw. Conf., 2003, vol. 1, pp. 307-310.
2. K. Lim, A. Obatoyinbo, A. Sutono, S. Chakraborty, C.-H. Lee, E. Gebara, A. Raghavan, and J. Laskar, "A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology," in IEEE Int. MTT-S Microw. Symp. Dig., 2001, vol. 3, pp. 1739-1742.
3. C.-H. Lee, A. Sutono, S. Han, K. Lim, S. Pinel, E. M. Tentzeris, and J. Laskar, "A compact LTCC-based Ku-band transmitter module," IEEE Trans. Adv. Packag., vol. 25, no. 3, pp. 374-384, Aug. 2002.
4. Y. P. Zhang, "Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers," IEEE Trans. Antennas Propag., vol. 52, no. 2, pp. 435-442, Feb. 2004.
5. Y. P. Zhang, "Integrated circuit ceramic ball grid array package antenna," IEEE Trans. Antennas Propag., vol. 52, no. 10, pp. 2538-2544, Oct. 2004.
6. R. L. Li, G. DeJean, K. Lim, M. M. Tentzeris, and J. Laskar, "Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless application," IEEE Trans. Adv. Packag., vol. 27, no. 4, pp. 581-589, Nov. 2004.
7. S. Brebels, J. Ryckaert, B. Côme, S. Donnay, W. De Raedt, E. Beyne, and R. P. Mertens, "SOP Integration and Codesign of Antennas," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 341-351, May 2004.
8. E. Tentzeris, "Design of compact stacked-patch antennas on LTCC technology for wireless communication applications," in Proc. IEEE Int. AP-S Symp., 2002, pp. 500-503.
9. R. L. Li, G. Gejean, M. M. Tentzeris, J. Laskar, and J. Papapolymerou, "LTCC multilayer based CP patch antenna surrounded by a soft-and-hard surface for GPS applications," in Proc. IEEE Int. AP-S Symp., 2003, pp. 651-654.
10. S. Consolazio, K. Nguyen, D. Biscan, K. Vu, A. Ferek, and A. Ramos, "Low temperature cofired ceramic (LTCC) for wireless applications," in IEEE MTT-S Symp. on Technologies for Wireless Applications, 1999, pp. 201-205.
11. K.-F. Tong, K.-M. Luk, K.-F. Lee, and R. Q. Lee, "Abroad-band U-slot rectangular patch antenna on a microwave substrate," IEEE Trans. Antennas Propag., vol. 48, no. 6, pp. 954-960, Jun. 2000.
12. S. Weigand, G. H. Huff, K. H. Pan, and J. T. Bernhard, "Analysis and design of broad-band single-layer rectangular U-slot microstrip patch antennas," IEEE Trans. Antennas Propag., vol. 51, no. 3, pp. 457-468, Jun 2000.
13. C. Kidder, M.-y. Li, and K. Chang, "Broad-band U-slot patch antenna with a proximity-coupled double Π-shaped feed line for arrays," IEEE Antenna Wireless Propag. Lett., vol. 1, pp. 2-4, 2002.
14. G. Kergonou and M. Drissi, "Finite size substrate and ground plane effects on propagation characteristics of planar interconnections," in Proc. IEEE Int. EMC Symp., 2002, vol. 2, pp. 701-704.
15. C.-C. Lu and C. Yu, "Computation of input impedance of printed antenna with finite size and arbitrarily shaped dielectric substrate and ground plane," IEEE Trans. Antennas Propag., vol. 52, no. 2, pp. 615-619, Feb. 2004.
16. H. A. Wheeler, "Fundamental limitations of small antennas," in Proc. IRE, Dec. 1947, vol. 35, pp. 1479-1484.
17. D. H. Schaubert, D. M. Pozar, and A. Adrian, "Effect of microstrip antenna substrate thickness and permittivity: Comparison of theories and experiment," IEEE Trans. Antennas Propag., vol. 37, no. 6, pp. 677-682, Jun. 1989.
18. R. B. Waterhouse, S. D. Targonski, and D. M. Kokotoff, "Design and performance of small printed antennas," IEEE Trans. Antennas Propag., vol. 46, no. 11, pp. 1629-1633, Nov. 1998.
19. J. W. Dally, Packaging of Electronic Systems. New York: McGrawHill, 1990.
20. S. Maeda, T. Kashiwa, and I. Fukai, "Full wave analysis of propagation characteristics of a through hole using the finite difference time-domain method," IEEE Trans. Microw. Theory Tech., vol. 39, no. 12, pp. 2154-2159, Dec. 1991.