Package-level integrated antennas based on LTCC technology

IEEE Transactions on Antennas and Propagation

Volumn 54, Issue 8, 2006, Pages 2190-2197

  Wi, Sang Hyuk ^a   Sun, Yong Bin ^b   Song, In Sang ^c   Choa, Sung Hoon ^c   Koh, Il Suek ^d   Lee, Yong Shik ^a   Yook, Jong Gwan ^a  

^a Yonsei University   (South Korea)

^b Kyonggi University   (South Korea)

^c Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^d Inha University   (South Korea)

Author keywords

Functional package; Package level integrated antenna; System on chip; System on package (SOP)

Indexed keywords

CERAMIC MATERIALS; DIRECTIONAL PATTERNS (ANTENNA); INTEGRATED CIRCUIT MANUFACTURE; NATURAL FREQUENCIES;

FUNCTIONAL PACKAGE; PACKAGE-LEVEL INTEGRATED ANTENNA; SYSTEM-ON-CHIP; SYSTEM-ON-PACKAGE;

CHIP SCALE PACKAGES;

EID: 33747604617     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2006.879191     Document Type: Article

References (22)

1. K. Lim, A. Obatoyinbo, A. Sutono, S. Chakraborty, C.-H. Lee, E. Gebara, A. Raghavan, and J. Laskar, "A highly integrated transceiver module for 5.8 GHz OFDM communication system using multilayer packaging technology," in IEEE Int. MTT-S Microwave Symp. Digest, 2001, vol. 3, pp. 1739-1742.
2. C.-H. Lee, A. Sutono, S. Han, K. Lim, S. Pinel, E. M. Tentzeris, and J. Laskar, "A compact LTCC-based Ku-band transmitter module," IEEE Trans. Adv. Packaging, vol. 25, no. 3, pp. 374-384, Aug. 2002.
3. Y. P. Zhang, "Integration of microstrip patch antenna on ceramic ball grid array package," Electron. Lett., vol. 38, no. 5, pp. 207-208, Fe. 2002.
4. S. Pinel, K. Lim, R. G. Dejean, L. Li, C.-H. Lee, M. Maeng, M. F. Davis, M. Tentzeris, and J. Laskar, "System-on-package (SOP) architectures for compact and the low cost RF front-end modules," in Proc. 33rd Eur. Microwave Conf., 2003, vol. 1, pp. 307-310.
5. Y. P. Zhang, "Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers," IEEE Trans. Antennas Propag., vol. 52, no. 2, pp. 435-442, Feb. 2004.
6. J. J. Wang, Y. Xue, Y. P. Zhang, K. M. Chua, A. C. W. Lu, L. L. Wai, and C. K. Wong, "Frequency-band selection for an integrated-circuit package antenna using LTCC technology," Microw. Opt. Technol. Lett., vol. 44, no. 5, pp. 439-441, Mar. 2005.
7. Y. P. Zhang, "Integrated circuit ceramic ball grid array package antenna," IEEE Trans. Antennas Propag., vol. 52, no. 10, pp. 2538-2544, Oct. 2004.
8. R. L. Li, G. DeJean, K. Lim, M. M. Tentzeris, and J. Laskar, "Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless application," IEEE Trans. Adv. Packaging, vol. 27, no. 4, pp. 581-589, Nov. 2004.
9. R. B. Waterhouse, S. D. Targonski, and D. M. Kokotoff, "Design and performance of small printed antennas," IEEE Trans. Antennas Propag., vol. 46, no. 11, pp. 1629-1633, Nov. 1998.
10. A. K. Shackelford, K.-F. Lee, and K. M. Luk, "Design of small-size wide-bandwidth microstrip-patch antennas," IEEE Antennas Propag. Mag., vol. 45, no. 1, pp. 75-83, Feb. 2003.
11. H. K. Kan and R. B. Waterhouse, "Size reduction technique for shorted patches," Electron. Lett., vol. 35, no. 12, pp. 948-949, Jun. 1999.
12. S.-H. Wi, J.-M. Kim, T.-H. Yoo, H.-J. Lee, J.-Y. Park, J.-G. Yook, and H.-K. Park, "Bow-tie-shaped meander slot antenna for 5 GHz application," in Proc. IEEE Int. Symp. Antenna and Propagation, Jun. 2002, vol. 2, pp. 456-459.
13. Y. Hwang, Y. P. Zhang, G. X. Zheng, and T. K. C. Lo, "Planar inverted F antenna loaded with high permittivity material," Electron. Lett., vol. 31, no. 20, pp. 1710-1712, Sep. 1995.
14. M.-C. Huynh and W. Stutzman, "Ground plane effects on planar inverted-F antenna (PIFA) performance," Proc. Inst. Elect. Eng. Microw. Antennas Propag., vol. 150, no. 4, pp. 209-213, Aug. 2003.
15. E. Tentzeris et al., "Design of compact stacked-patch antennas on LTCC technology for wireless communication applications," in Proc. IEEE Int. AP-S Symp., 2002, pp. 500-503.
16. R. L. Li, G. Gejean, M. M. Tentzeris, J. Laskar, and J. Papapolymerou, "LTCC multilayer based CP patch antenna surrounded by a soft-and-hard surface for GPS applications," in Proc. IEEE Int. AP-S Symp., 2003, pp. 651-654.
17. W. S. T. Rowe and R. B. Waterhouse, "Reduction of backward radiation for CPW fed aperture stacked patch antennas on small ground planes," IEEE Trans. Antennas Propag., vol. 51, no. 6, pp. 1411-1413, Jun. 2003.
18. S. Mestdagh, W. De Raedt, and G. A. E. Vandenbosch, "CPW-fed stacked microstrip antennas," IEEE Trans. Antennas Propag., vol. 52, no. 1, pp. 74-83, Jan. 2004.
19. A. Mitchell, M. Lech, D. M. Kokotoff, and R. B. Waterhouse, "Search for high-performance probe-fed stacked patches using optimization," IEEE Trans. Antennas Propag., vol. 52, no. 2, pp. 249-255, Feb. 2003.
20. G. Kergonou and M. Drissi, "Finite size substrate and ground plane effects on propagation characteristics of planar interconnections," in Proc. IEEE Int. EMC Symp., 2002, vol. 2, pp. 701-704.
21. S. Maeda, T. Kashiwa, and I. Fukai, "Full wave analysis of propagation characteristics of a through hole using the finite difference time-domain method," IEEE Trans. Microw. Theory Tech., vol. 39, no. 12, pp. 2154-2159, Dec. 1991.
22. R. Li, G. DeJean, M. M. Tentzeris, J. Papapolymerou, and J. Laskar, "Radiation-pattern improvement of patch antennas on a large-size substrate using a compact soft-surface structure and its realization on LTCC multilayer technology," IEEE Trans. Antennas Propag., vol. 53, no. 1, pp. 200-208, Jan. 2005.