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Volumn 15, Issue 9, 2009, Pages 1373-1378

A microchannel heat exchanger design for microelectronics cooling correlating the heat transfer rate in terms of Brinkman number

Author keywords

[No Author keywords available]

Indexed keywords

BRINKMAN NUMBER; CHANNEL WIDTHS; COMMERCIAL CODES; CONVENTIONAL THEORY; COOLING EFFICIENCY; HEAT TRANSFER RATE; HEAT TRANSFER THEORY; MAXIMUM COOLING; MICRO ELECTRONICS COOLING; MICROCHANNEL HEAT EXCHANGER; NEW CORRELATIONS; NUMERICAL CODE; PUMPING PERFORMANCE; THERMAL RESISTANCE;

EID: 68949148772     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0900-8     Document Type: Article
Times cited : (15)

References (12)
  • 3
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    • Optimization of parallel plate heatsinks for forced convection
    • Copeland D (2000) Optimization of parallel plate heatsinks for forced convection. In: 16th IEEE SEMI-THERM Symposium, pp 266-272
    • (2000) 16th IEEE SEMI-THERM Symposium , pp. 266-272
    • Copeland, D.1
  • 4
    • 26044474514 scopus 로고    scopus 로고
    • Analysis of laminar convective heat transfer in micro heat exchanger for stacked multi-chip module
    • MK Kang JH Shin HH Lee 2005 Analysis of laminar convective heat transfer in micro heat exchanger for stacked multi-chip module Microsyst Technol 11 1176 1186
    • (2005) Microsyst Technol , vol.11 , pp. 1176-1186
    • Kang, M.K.1    Shin, J.H.2    Lee, H.H.3
  • 7
    • 2642546773 scopus 로고    scopus 로고
    • Single-phase convective heat transfer in microchannels. A review of experimental results
    • GL Morini 2004 Single-phase convective heat transfer in microchannels. A review of experimental results Int J Thermal Sci 43 631 651
    • (2004) Int J Thermal Sci , vol.43 , pp. 631-651
    • Morini, G.L.1
  • 8
    • 47349098291 scopus 로고    scopus 로고
    • Friction factor and heat transfer in multiple microchannels with uniform flow distribution
    • HS Park J Punch 2008 Friction factor and heat transfer in multiple microchannels with uniform flow distribution Int J Heat Mass Transf 51 4535 4543
    • (2008) Int J Heat Mass Transf , vol.51 , pp. 4535-4543
    • Park, H.S.1    Punch, J.2
  • 10
    • 38349186967 scopus 로고    scopus 로고
    • Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader
    • Y Wang GF Ding 2008 Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader Microsyst Technol 14 389 395
    • (2008) Microsyst Technol , vol.14 , pp. 389-395
    • Wang, Y.1    Ding, G.F.2
  • 11
    • 36749102081 scopus 로고    scopus 로고
    • Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices
    • X Wei Y Joshi MK Patterson 2007 Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices J Heat Transf 129 1432 1444
    • (2007) J Heat Transf , vol.129 , pp. 1432-1444
    • Wei, X.1    Joshi, Y.2    Patterson, M.K.3
  • 12
    • 33744529776 scopus 로고    scopus 로고
    • Microchannel heat sink fabrication with roughened bottom walls
    • H Yang F Lee R Chein 2006 Microchannel heat sink fabrication with roughened bottom walls Microsyst Technol 12 760 765
    • (2006) Microsyst Technol , vol.12 , pp. 760-765
    • Yang, H.1    Lee, F.2    Chein, R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.