Analysis of laminar convective heat transfer in micro heat exchanger for stacked multi-chip module

Microsystem Technologies

Volumn 11, Issue 11, 2005, Pages 1176-1186

  Kang, Moon Koo ^a   Shin, Joong Han ^a   Lee, Hae Hyung ^a   Chun, Kukjin ^a  

^a Seoul National University   (South Korea)

Author keywords

Channel aspect ratio; Entry length effect; Micro heat exchanger; Multi chip module (MCM)

Indexed keywords

COOLANTS; HEAT EXCHANGERS; LAMINAR FLOW; MICROELECTRONICS; NUMERICAL METHODS; SUPERCOOLING;

COOLING PERFORMANCE; DESIGN VARIATIONS; MICRO HEAT EXCHANGERS; MULTI-CHIP MODULES (MCM);

HEAT TRANSFER;

EID: 26044474514     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0590-9     Document Type: Review

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