Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader

Microsystem Technologies

Volumn 14, Issue 3, 2008, Pages 389-395

  Wang, Y ^a   Ding, G F ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT SINKS; HEAT TRANSFER; SOFTWARE PACKAGES;

COPPER HEAT SPREADER; MICROCHANNEL HEAT SINK; SERIES ANALYSIS; TRANSVERSE CHANNEL ARRAYS;

MICROCHANNELS;

EID: 38349186967     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0455-5     Document Type: Article

References (9)

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