Quick and clean: stencil lithography for wafer-scale fabrication of superconducting tunnel junctions

IEEE Transactions on Applied Superconductivity

Volumn 19, Issue 3, 2009, Pages 242-244

  Savu, Veronica ^a   Kivioja, Jani ^b   Ahopelto, Jouni ^b   Brugger, Juergen ^a  

^a EPFL   (Switzerland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Shadow mask; Stencil lithography; STJ; Superconducting tunnel junction

Indexed keywords

CONTACT ELECTRODES; FURTHER DEVELOPMENT; IN-SITU OXIDATION; LOW STRESS; SHADOW MASK; STENCIL LITHOGRAPHY; STJ; SUBMICROMETERS; SUBSTRATE WAFER; SUPERCONDUCTING TUNNEL JUNCTION; WAFER SCALE FABRICATION;

ALUMINUM; FABRICATION; LITHOGRAPHY; MICROMETERS; SILICON NITRIDE; SUPERCONDUCTING DEVICES; SUPERCONDUCTIVITY; TUNNELS; WIND TUNNELS;

TUNNEL JUNCTIONS;

EID: 68649103192     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2009.2019075     Document Type: Conference Paper

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