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Volumn 30, Issue 8, 2009, Pages 879-881

Vertical-Si-Nanowire SONOS memory for ultrahigh-density application

Author keywords

3 D Flash memory; Gate all around (GAA); Vertical silicon nanowire (SiNW)

Indexed keywords

3-D FLASH MEMORY; BUILDING BLOCKES; CMOS-COMPATIBLE TECHNOLOGY; GATE ALL AROUND (GAA); GATE STACKS; GATE-ALL-AROUND; MULTILEVEL MEMORY; PROGRAM/ERASE; SI NANOWIRE; SONOS FLASH MEMORY; SONOS MEMORY; ULTRAHIGH DENSITY; VERTICAL SILICON NANOWIRE (SINW);

EID: 68349116131     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2009.2024442     Document Type: Article
Times cited : (30)

References (9)
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    • 64549115761 scopus 로고    scopus 로고
    • Non-volatile memory technologies: The quest for ever lower cost
    • S. Lai, "Non-volatile memory technologies: The quest for ever lower cost," in IEDM Tech. Dig., 2008, pp. 11-16.
    • (2008) IEDM Tech. Dig , pp. 11-16
    • Lai, S.1
  • 2
    • 49049108116 scopus 로고    scopus 로고
    • Future memory technology: Challenges and opportunities
    • K. Kim, "Future memory technology: Challenges and opportunities," in Proc. Int. Symp. VLSI-TSA, 2008, pp. 5-9.
    • (2008) Proc. Int. Symp. VLSI-TSA , pp. 5-9
    • Kim, K.1
  • 3
    • 11144225791 scopus 로고    scopus 로고
    • Future directions and challenges for ETOX Flash memory scaling
    • Sep
    • G. Atwood, "Future directions and challenges for ETOX Flash memory scaling," IEEE Trans. Device Mater. Rel., vol. 4, no. 3, pp. 301-305, Sep. 2004.
    • (2004) IEEE Trans. Device Mater. Rel , vol.4 , Issue.3 , pp. 301-305
    • Atwood, G.1
  • 4
    • 21644486546 scopus 로고    scopus 로고
    • 3-dimensional nano-CMOS transistors to overcome scaling limits
    • D. Park, K. Kim, and B. I. Ryu, "3-dimensional nano-CMOS transistors to overcome scaling limits," in Proc. Solid-State Integr. Circuits Technol., 2004, vol. 1, pp. 35-40.
    • (2004) Proc. Solid-State Integr. Circuits Technol , vol.1 , pp. 35-40
    • Park, D.1    Kim, K.2    Ryu, B.I.3
  • 5
    • 46049113542 scopus 로고    scopus 로고
    • Three dimensionally stacked NAND Flash memory technology using stacking single crystal Si layers on ILD and TANOS structure for beyond 30 nm node
    • S. Jung, J. Jang, W. Cho, H. Cho, J. Jeong, Y. Chang, J. Kim, Y. Rah, Y. Son, J. Park, M. Song, K. Kim, J. Lim, and K. Kim, "Three dimensionally stacked NAND Flash memory technology using stacking single crystal Si layers on ILD and TANOS structure for beyond 30 nm node," in IEDM Tech. Dig., 2006, pp. 37-40.
    • (2006) IEDM Tech. Dig , pp. 37-40
    • Jung, S.1    Jang, J.2    Cho, W.3    Cho, H.4    Jeong, J.5    Chang, Y.6    Kim, J.7    Rah, Y.8    Son, Y.9    Park, J.10    Song, M.11    Kim, K.12    Lim, J.13    Kim, K.14


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.