An estimation method on failure stress of micro thickness Cu film-substrate structure

Science in China, Series E: Technological Sciences

Volumn 52, Issue 8, 2009, Pages 2210-2215

  Wang, Xishu ^a   Li, Ying ^a   Meng, Xiangkang ^b  

^a TSINGHUA UNIVERSITY   (China)

^b NANJING UNIVERSITY   (China)

Author keywords

Failure stress; Film substrate structure; In situ observation; Interfacial strength; Nano scratch test

Indexed keywords

COMPLEX EFFECTS; CU FILMS; CU THIN FILM; EFFECT FACTORS; ELASTIC ANISOTROPY; EMPIRIC EQUATION; ESTIMATING METHOD; ESTIMATION METHODS; FAILURE BEHAVIORS; FAILURE CRITERIA; FAILURE MODEL; FAILURE STRESS; FREE SURFACES; IN-SITU; IN-SITU OBSERVATION; INTERFACIAL STRENGTH; NANO SCRATCH TEST; SCANNING ELECTRON MICROSCOPES; STRESS STATE; SUBSTRATE STRUCTURE; TESTING RESULTS; UNSTABLE BEHAVIOR;

COPPER; ESTIMATION; FILM THICKNESS; METALLIC FILMS; QUALITY ASSURANCE; SCANNING ELECTRON MICROSCOPY; THIN FILM DEVICES; THIN FILMS; VAPOR DEPOSITION;

SUBSTRATES;

EID: 67650770192     PISSN: 10069321     EISSN: 1862281X     Source Type: Journal    
DOI: 10.1007/s11431-009-0235-9     Document Type: Article

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