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Volumn 47, Issue 11, 2009, Pages 1112-1124

Reinforcement of solid-melt interfaces for semicrystalline polymers in a sequential two-staged injection molding process

Author keywords

Adhesion; Injection molding; Interfaces; Polyamide 6; Polyethylene; Reinforcement; Sequential two staged injection molding process; Solid melt interfaces

Indexed keywords

BONDING PROCESS; COHESIVE FAILURES; FRACTURE FAILURE; FRACTURE SURFACES; IN-SITU; INJECTION MOLDING PROCESS; INJECTION PRESSURES; INJECTION SPEED; INTERFACES; INTERFACIAL ADHESIONS; INTERFACIAL TEMPERATURE; LAP SHEAR; MELT TEMPERATURE; MOLD TEMPERATURES; POLYAMIDE 6; PROCESSING PARAMETERS; REACTIVE COMPATIBILIZATION; SEM; SEMI-CRYSTALLINE POLYMER; SEQUENTIAL TWO-STAGED INJECTION MOLDING PROCESS; SOLID-MELT INTERFACES;

EID: 67650753948     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/polb.21719     Document Type: Article
Times cited : (15)

References (25)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.