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Volumn 47, Issue 11, 2009, Pages 1112-1124
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Reinforcement of solid-melt interfaces for semicrystalline polymers in a sequential two-staged injection molding process
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Author keywords
Adhesion; Injection molding; Interfaces; Polyamide 6; Polyethylene; Reinforcement; Sequential two staged injection molding process; Solid melt interfaces
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Indexed keywords
BONDING PROCESS;
COHESIVE FAILURES;
FRACTURE FAILURE;
FRACTURE SURFACES;
IN-SITU;
INJECTION MOLDING PROCESS;
INJECTION PRESSURES;
INJECTION SPEED;
INTERFACES;
INTERFACIAL ADHESIONS;
INTERFACIAL TEMPERATURE;
LAP SHEAR;
MELT TEMPERATURE;
MOLD TEMPERATURES;
POLYAMIDE 6;
PROCESSING PARAMETERS;
REACTIVE COMPATIBILIZATION;
SEM;
SEMI-CRYSTALLINE POLYMER;
SEQUENTIAL TWO-STAGED INJECTION MOLDING PROCESS;
SOLID-MELT INTERFACES;
ADHESION;
DIFFERENTIAL SCANNING CALORIMETRY;
INJECTION MOLDING;
MALEIC ANHYDRIDE;
PLASTIC MOLDS;
POLYMER MELTS;
REACTIVE MOLDING;
REINFORCEMENT;
SCANNING;
SCANNING ELECTRON MICROSCOPY;
THERMOPLASTICS;
FRACTURE;
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EID: 67650753948
PISSN: 08876266
EISSN: None
Source Type: Journal
DOI: 10.1002/polb.21719 Document Type: Article |
Times cited : (15)
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References (25)
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